Innoventions RAMCHECK LX, Руководство пользователя

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4. RAMCHECK LX OPERATION RAMCHECK LX OWNER’S MANUAL
the EXTENSIVE test
terminates the
current step and
proceeds to the next
one (within the
EXTENSIVE test).
while scanning from first address to last address, the test verifies that a 0
remains in each location, then it is replaced with a 1. After the entire
memory address is “marched up” in this fashion, the process reverses
itself to perform the “march down” test. This time while scanning from
the last address to the first address, the test verifies that a 1 remains in
each location and then replaces it with a 0.
Relative Refresh and
Relatively Spikes are
used only for legacy
EDO/FPM devices.

Relative Refresh/cell leakage: This test provides a relative value for
the ability of the memory chip to retain data between refresh cycles.
"Relative" means that the result is not an absolute time value but a
comparative one. Relative relation between values is exponential.
For example: A DUT with a relative value of "5" retained data integrity
twice as long as one with a value of "4" without requiring refresh.
Typical good values are 3 and higher. Since this test is of the Out-of-
Specification type, lower results do not imply that a module is defective,
as it can still work within its published specifications!

Relative Voltage Spikes Performance:
This test provides a relative
value that indicates how well a module can sustain voltage spikes before
a data loss occurs. Relative relations here are not exponential. Typical
good values are 3 and above. Since this test is of the Out-of-
Specification type, lower results do not imply that a module is defective,
as it can still work within its published specifications!
As you watch the red Module Power LED during the Relative Voltage
Spikes test, you will see that it flashes vigorously. This LED is directly
connected to the module's power supply. RAMCHECK LX creates
artificial voltage spikes (of 5V to 1.5V or to 6.0V) after loading a
complete test pattern. Memory devices with higher Relative Voltage
Spikes figures can withstand more spikes in an actual application. Take
into account that modules with larger built-in capacitors normally
exhibit higher Relative Voltage Spikes figures due to the capacitors'
smoothing effect on the spikes. Some complex modules, which utilize
PAL chips and/or logic chips, may exhibit significantly lower Relative
Voltage Spikes figures.
Note that ALL relative tests are absolutely safe, as RAMCHECK
LX DOES NOT exceed any allowable voltage/current rating!

Temperature stress test (Chip-Heat Mode): In this phase,
RAMCHECK LX tests memory chips at the actual higher operating
temperature experienced inside a computer. Being able to test at the
proper temperature is extremely important because some memory
problems are not seen until the chip is warmed up. As the mode
progresses, note that RAMCHECK LX will display the heating current
in Ampere units.
The EXTENSIVE test display shows the current test type, duration of test,
applied voltage, Access Time (speed in nanoseconds or frequency rate), and
module mode type and size. The final test results look similar to those of the
BASIC test. Note that because the DUT is tested at a higher temperature
during the Chip-Heat portion of the EXTENSIVE test, the Access Time may
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