IBM 7063-CR2, Руководство пользователя

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Figure 71. Unlatching the system backplane
e) Support the system backplane by the bottom as you slide it from the system.
Figure 72. Removing the system backplane
f) Place the system backplane on an ESD surface.
Note: You must remove and replace the system backplane at a flat angle. The ventilation holes in
the top cover can come into contact with the DIMMs in the system backplane if the insertion of the
backplane is at an angle or is rushed. As a result of possible contact, DIMMs can be scratched and can
leave residue on the top cover.
Replacing the system backplane in the 7063-CR2 system
To replace the system backplane in the IBM Power Systems HMC (7063-CR2) system, complete the steps
in this procedure.
Procedure
1. Ensure that you have the electrostatic discharge (ESD) wrist strap on and that the ESD clip is plugged
into a ground jack or connected to an unpainted metal surface. If not, do so now.
2. Remove the replacement system backplane from the static-protective package and place it on an
ESD mat next to the old system backplane.
The following steps move the system processor module from the old system backplane to the new system
backplane:
3. Loosen the load arm screw (A) of the system processor heat sink (B) that you are removing with a T20
hexalobular driver. The load arm pivots up in the direction that is shown in the following figure.
Removing and replacing parts in the 7063-CR2 55