IBM 3409-S03, Инструкция по эксплуатации прибора

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Cooling modules
Each of the five cooling modules contains two stacked fans: 80 mm x 80 mm x 38 mm.
AP-TL-1 and AP-LS-1 compute modules
The specifications table for the compute modules.
Table 15. Compute canister specifications
AP-TL-1 AP-LS Family
Module Type Application platform (AP) Application platform (AP)
CPU Options Intel “Sandy Bridge-EP” Xeon
v E5-2609 4-core 2.4GHz (80W)
v E5-2630L 6-core 2.0GHz (60W)
v E5-2648L 8-core 1.8GHz (70W)
Intel “Ivy Bridge-EP” Xeon
v E5-2609 v2 4-core 2.5GHz (80W)
v E5-2618L v2 6-core 2.0GHz (50W)
v E5-2630 v2 6-core 2.6GHz (80W)
v
E5-2648L v2 10-core 1.9GHz (70W)
AP-LS-1 is designed to support the
Intel Haswell-EP and Broadwell-EP
CPUs.
RAM Options DDR3 VLP DIMMs DDR4DIMMs (including support for
RDIMMs and ECC RAM)2
Boot Drive SATA SSD 1or 2 x internal NGFF M.2 mSATA
SSD
Expansion Cards 1PCIe x8 card (half length, half
height, custom bezel) “LS1”: 1 half length, half height
PCIeslot and a Daughter Card slot
(based on PCIe) sized specifically for
use in LS.
Battery None Metis Redundant Battery solution
Interfaces
1
SAS 1x External SAS Ports x 6Gb/s (4
laneseach) 2x Internal SAS ports x 12Gb/s (4
lanes each), 2 x External SAS ports x
12Gb/s (4 lanes each)
Ethernet 2 x 1Gb 3 x 1Gb
Fibre Channel None None
USB 2 x USB 2.0 2 x USB 3.0
HDMI None 1 Type D (Micro)
Serial (3.5mm) 1 1
1
Other interfaces can be added to LS controllers by using a PCIe expansion card or the Daughter Card Slot – but
these are factory options.
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Slicestor
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2584 Appliance Manual