8
FH67 Series
●
0.5mm Pitch, 3.57mm depth One Action Lock, Vertical connection FPC/FFC/Shield FFC connector
Temperature Profile
Applicable Conditions
Reflow method
: IR/Hot air
Reflow environment : Room air
Solder
: Paste type Sn/3.0Ag/0.5Cu
(M705-GRN360-K2-V made by
Senju Metal Industry Co.)
Test PCB
: PCB material and size
Glass epoxy 45×25×1mm
Land size, per recommended on
page
4.
Metal mask
: Thickness and opening size
Per recommendation on page 4.
This temperature profile is based on the above conditions.
It may vastly depending on solder paste type,
manufacturer, PCB size and mounting materials. Please
use only after checking the mounting conditions.
MAX 250°C
25°C
60 to 90 sec.
20 to 40
sec.
120±5 sec.
Preheating time
Soldering time
Peak temperature
0
50
100
150
150°C
180°C
220°C
200
245
Start
Temperature
(
°C
)
Time (sec.)
Sep.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved.