4.
Remove the heat sink (4).
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink
and the system board components, it may be necessary to move the heat sink from side to side to
detach it.
The following illustration shows the replacement thermal material locations on the system board and
the heat sink on computer models equipped with a graphics subsystem with discrete memory. The thermal
material must be thoroughly cleaned from the surfaces of the system board and the heat sink components
each time the heat sink is removed. Replacement thermal material is included with the system board and
heat sink spare part kits.
Thermal paste is used on the processor (1) and on the heat sink component (2) that services it. Thermal
paste is also used on the graphics subsystem component (3) and on the heat sink component (4) that
services it.
86
Chapter 6 Removal and replacement procedures for Authorized Service Provider parts
ENWW
Содержание ZBook 14 G2 Mobile Workstation
Страница 4: ...iv Important Notice about Customer Self Repair Parts ENWW ...
Страница 6: ...vi Safety warning notice ENWW ...
Страница 25: ...2 Getting to know your computer ENWW 15 ...
Страница 36: ...26 Chapter 2 Getting to know your computer ENWW ...
Страница 38: ...Computer major components 28 Chapter 3 Illustrated parts catalog ENWW ...
Страница 54: ...44 Chapter 3 Illustrated parts catalog ENWW ...
Страница 60: ...50 Chapter 4 Removal and replacement procedures preliminary requirements ENWW ...
Страница 114: ...104 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts ENWW ...
Страница 138: ...128 Chapter 11 Power cord set requirements ENWW ...
Страница 140: ...130 Chapter 12 Recycling ENWW ...
Страница 144: ...134 Index ENWW ...