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Specifications 57

Specifications

Environmental specifications

Specification

Value

Temperature range*

Operating

C to 35

C (50

F to 95

Shipping

-40

C to 70

C (-40

F to 158

Maximum wet bulb temperature 28

C (82.4

Relative humidity
(noncondensing)**

Operating

10% to 90%

Nonoperating

5% to 95%

* All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3,048

m (10,000 ft) is applicable. No direct sunlight allowed.

** Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F). Altitude maximum for
storage corresponds to a pressure minimum of 70 kPa.

Hot-plug power supply calculations

For hot-plug power supply specifications and calculators to determine electrical and heat loading for the

server, refer to the HP Enterprise Configurator website

Содержание ProLiant SL4545 G7

Страница 1: ...ecifications for hardware components and software for the HP ProLiant SL4545 G7 Server Node This guide is for an experienced service technician HP assumes you are qualified in the servicing of computer equipment trained in recognizing hazards in products and are familiar with weight and stability precautions Part Number 683993 002 December 2012 Edition 2 ...

Страница 2: ...are set forth in the express warranty statements accompanying such products and services Nothing herein should be construed as constituting an additional warranty HP shall not be liable for technical or editorial errors or omissions contained herein Microsoft and Windows are U S registered trademarks of Microsoft Corporation AMD is a trademark of Advanced Micro Devices Inc ...

Страница 3: ...c discharge 23 Symbols on equipment 24 Server warnings and cautions 24 Drive blank 25 Drive 25 DIMMs 27 Processor air baffle 28 Heatsink 28 Processor 30 SFF backplane board 35 Front panel board 36 Personality board assembly 37 System board 38 System battery 45 HP Trusted Platform Module 46 Diagnostic tools 47 HP ROM Based Setup Utility 47 HP Insight Diagnostics 47 Integrated Management Log 47 HP I...

Страница 4: ... definitions 53 System board components 53 DIMM slots 54 System board switches 54 NMI jumper 55 Personality board components 56 Specifications 57 Environmental specifications 57 Hot plug power supply calculations 57 Acronyms and abbreviations 58 Documentation feedback 59 Index 60 ...

Страница 5: ...n will help you over the telephone HP specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to HP In cases where it is required to return the defective part to HP you must ship the defective part back to HP within a defined period of time normally five 5 business days The defective part must be returned with the associated documentation in the pro...

Страница 6: ...ine la société de courses ou le transporteur à utiliser Pour plus d informations sur le programme CSR de HP contactez votre Mainteneur Agrée local Pour plus d informations sur ce programme en Amérique du Nord consultez le site Web HP http www hp com go selfrepair Service de garantie pièces seules Votre garantie limitée HP peut inclure un service de garantie pièces seules Dans ce cas les pièces de ...

Страница 7: ... Self Repair um Reparaturzeiten zu minimieren und höhere Flexibilität beim Austausch defekter Bauteile zu ermöglichen Wenn HP oder ein HP Servicepartner bei der Diagnose feststellt dass das Produkt mithilfe eines CSR Teils repariert werden kann sendet Ihnen HP dieses Bauteil zum Austausch direkt zu CSR Teile werden in zwei Kategorien unterteilt Zwingend Teile für die das Customer Self Repair Verfa...

Страница 8: ...tegorías Obligatorio componentes para los que la reparación por parte del usuario es obligatoria Si solicita a HP que realice la sustitución de estos componentes tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio Opcional componentes para los que la reparación por parte del usuario es opcional Estos componentes también están diseñados para que puedan ser r...

Страница 9: ...orieën CSR onderdelen Verplicht Onderdelen waarvoor reparatie door de klant verplicht is Als u HP verzoekt deze onderdelen voor u te vervangen worden u voor deze service reiskosten en arbeidsloon in rekening gebracht Optioneel Onderdelen waarvoor reparatie door de klant optioneel is Ook deze onderdelen zijn ontworpen voor reparatie door de klant Als u echter HP verzoekt deze onderdelen voor u te v...

Страница 10: ...ependendo do tipo de serviço de garantia destinado ao produto OBSERVAÇÃO Algumas peças da HP não são projetadas para o reparo feito pelo cliente A fim de cumprir a garantia do cliente a HP exige que um técnico autorizado substitua a peça Essas peças estão identificadas com a marca No Não no catálogo de peças ilustrado Conforme a disponibilidade e o local geográfico as peças CSR serão enviadas no p...

Страница 11: ...Customer self repair 11 No caso desse serviço a substituição de peças CSR é obrigatória Se desejar que a HP substitua essas peças serão cobradas as despesas de transporte e mão de obra do serviço ...

Страница 12: ...Customer self repair 12 ...

Страница 13: ...Customer self repair 13 ...

Страница 14: ...Customer self repair 14 ...

Страница 15: ...ligatoire Si vous demandez à HP de remplacer ces pièces les coûts de déplacement et main d œuvre du service vous seront facturés 2 Optional Facultatif Pièces pour lesquelles la réparation par le client est facultative Ces pièces sont également conçues pour permettre au client d effectuer lui même la réparation Toutefois si vous demandez à HP de remplacer ces pièces l intervention peut ou non vous ...

Страница 16: ...rantía correspondiente al producto 3 No No Algunos componentes no están diseñados para que puedan ser reparados por el usuario Para que el usuario haga valer su garantía HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes Dichos componentes se identifican con la palabra No en el catálogo ilustrado de componentes 1 Mandatory Verplicht Onderdel...

Страница 17: ...Illustrated parts catalog 17 System components ...

Страница 18: ...s a 2 8 GHz AMD Opteron Model 4226 689243 001 Optional2 b 3 3 GHz AMD Opteron Model 4238 689242 001 Optional2 c 2 5 GHz AMD Opteron Model 4274HE 689241 001 Optional2 d 3 0 GHz AMD Opteron Model 4284 689240 001 Optional2 9 Heatsink 620812 001 Optional2 10 Personality board assembly 689238 001 Optional2 11 SFF hard drive backplane board 689231 001 Mandatory1 12 Front panel board 689232 001 Mandatory...

Страница 19: ...e Versand und Arbeitskosten für diesen Service berechnet 2 Optional Optional Teile für die das Customer Self Repair Verfahren optional ist Diese Teile sind auch für Customer Self Repair ausgelegt Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen 3 No Kein Eini...

Страница 20: ...e a HP as substitua pode haver ou não a cobrança de taxa adicional dependendo do tipo de serviço de garantia destinado ao produto 3 No Nenhuma Algumas peças da HP não são projetadas para o reparo feito pelo cliente A fim de cumprir a garantia do cliente a HP exige que um técnico autorizado substitua a peça Essas peças estão identificadas com a marca No Não no catálogo de peças ilustrado ...

Страница 21: ... rack creates unstable conditions then remove the node from the chassis Remove the access panel on page 23 Install the access panel on page 23 Power down the node Before powering down the node for any upgrade or maintenance procedures perform a backup of critical server data and programs IMPORTANT When the node is in standby mode auxiliary power is still being provided to the system To power down ...

Страница 22: ...ove a node from the chassis 1 Power down the node on page 21 CAUTION To avoid damage to the node always support the bottom of the node when removing it from the chassis 2 Remove the node from the chassis a Press the release button b Lower the handle c Remove the node CAUTION To avoid damage to the device do not use the removal handle to carry it 3 Place the node on a flat level surface Installing ...

Страница 23: ...ll the safety information Preventing electrostatic discharge To prevent damaging the system be aware of the precautions you need to follow when setting up the system or handling parts A discharge of static electricity from a finger or other conductor may damage system boards or other static sensitive devices This type of damage may reduce the life expectancy of the device To prevent electrostatic ...

Страница 24: ...r injury exists WARNING To reduce the risk of injury from a hot component allow the surface to cool before touching 7 71 kg 17 00 lb This symbol indicates that the component exceeds the recommended weight for one individual to handle safely WARNING To reduce the risk of personal injury or damage to the equipment observe local occupational health and safety requirements and guidelines for manual ma...

Страница 25: ...is manner results in improper airflow and improper cooling that can lead to thermal damage Drive blank Remove the component as indicated CAUTION To prevent improper cooling and thermal damage do not operate the server unless all bays are populated with either a component or a blank To replace the component slide the component into the bay until it clicks Drive To remove the component 1 Determine t...

Страница 26: ...emove the drive To replace the component CAUTION To prevent improper cooling and thermal damage do not operate the HP ProLiant SL4500 Series unless all drive and device bays are populated with either a component or a blank 1 Prepare the drive ...

Страница 27: ...e from the drive LED definitions on page 53 DIMMs To remove the component 1 Power down the node on page 21 2 Remove the node from the chassis Remove a node from the chassis on page 22 3 Remove the access panel on page 23 4 Remove the DIMM To replace the component reverse the removal procedure ...

Страница 28: ...ffle To replace the component reverse the removal procedure Heatsink To remove the component CAUTION The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed 1 Power down the node on page 21 2 Remove the node from the chassis Remove a node from the chassis on page 22 3 Remove the access panel on page 23 4 Re...

Страница 29: ...rease from the processor Allow the alcohol to evaporate before continuing 2 Remove the thermal interface protective cover from the heatsink CAUTION To avoid damage to the system board processor socket and screws do not overtighten the heatsink screws Use the wrench supplied with the system to reduce the possibility of overtightening the screws ...

Страница 30: ...in processors with the same part number CAUTION To avoid damage to the processor and system board only authorized personnel should attempt to replace or install the processor in this node CAUTION The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed IMPORTANT Processor socket 1 must be populated at all ti...

Страница 31: ...move the heatsink CAUTION Failure to completely open the processor locking lever prevents the processor from seating during installation leading to hardware damage 7 Open the processor retaining latch and the processor socket retaining bracket ...

Страница 32: ...RTANT Be sure the processor remains inside the processor installation tool 9 If the processor has separated from the installation tool carefully reinsert the processor into the tool Handle the processor by the edges only and do not touch the bottom of the processor especially the contact area ...

Страница 33: ... ARE VERY FRAGILE AND EASILY DAMAGED To avoid damage to the system board Never install or remove a processor without using the processor installation tool Do not touch the processor socket contacts Do not tilt or slide the processor when lowering the processor into the socket 11 Press down firmly until the processor installation tool clicks and separates from the processor and then remove the proc...

Страница 34: ... alcohol swab to remove all the existing thermal grease from the heatsink Allow the alcohol to evaporate before continuing 14 Apply the thermal grease to the top of the processor in the following pattern CAUTION To avoid damage to the system board processor socket and screws do not overtighten the heatsink screws Use the wrench supplied with the system to reduce the possibility of overtightening t...

Страница 35: ...s Installing a node into the chassis on page 22 19 Power up the server SFF backplane board To remove the component 1 Power down the node on page 21 2 Remove the node from the chassis Remove a node from the chassis on page 22 3 Remove the access panel on page 23 4 Remove the processor air baffle Processor air baffle on page 28 5 Disconnect all cables from the SFF backplane board 6 Remove two screws...

Страница 36: ...e component 1 Power down the node on page 21 2 Remove the node from the chassis Remove a node from the chassis on page 22 3 Remove the access panel on page 23 4 Disconnect all cables from the front panel board 5 Remove the three screws securing the front panel board to the node 6 Remove the board To replace the component reverse the removal procedure ...

Страница 37: ... the chassis on page 22 3 Remove the access panel on page 23 4 Disconnect all cables connected from the top of the personality board 5 Remove the screws securing the personality board assembly to the node CAUTION Do not remove the four screws that secure the personality board to the bracket Only remove the screws that secure the personality board assembly to the system board ...

Страница 38: ...d assembly To replace the component reverse the removal procedure System board To remove the system board 1 Power down the node on page 21 2 Remove the node from the chassis Remove a node from the chassis on page 22 3 Remove the access panel on page 23 4 Remove the processor air baffle Processor air baffle on page 28 5 Remove all DIMMs DIMMs on page 27 ...

Страница 39: ...move all heatsinks CAUTION Failure to completely open the processor locking lever prevents the processor from seating during installation leading to hardware damage 7 Open the processor retaining latch and the processor socket retaining bracket ...

Страница 40: ...r after removing the processor from the socket Do not tilt or slide the processor when removing the processor from the socket CAUTION To avoid damage to the processor Handle the processor only by the edges Do not touch the bottom of the processor especially the contact area 9 Remove the personality board assembly on page 37 10 Disconnect all cables from the system board 11 Remove the failed system...

Страница 41: ... To replace the system board 1 Align the system board on the tray and then install the screws 2 Connect all cables to the system board 3 Prepare the processor socket on the spare system board a Remove the processor socket protective cover ...

Страница 42: ...he failed system board 5 Install the processor on the spare system board CAUTION The processor is designed to fit one way into the socket Use the alignment guides on the processor and socket to properly align the processor with the socket Refer to the node hood label for specific instructions CAUTION Always install the processor parallel to the system board to avoid damage to the pins ...

Страница 43: ...ssor socket retaining bracket 7 Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab Allow the alcohol to evaporate before continuing 8 Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution ...

Страница 44: ...NG WARNING WARNING The serial number is loaded into the system during the manufacturing process and should NOT be modified This option should only be used by qualified service personnel This value should always match the serial number sticker located on the chassis Warning The serial number should ONLY be modified by qualified service personnel This value should always match the serial number loca...

Страница 45: ...e the battery to temperatures higher than 60 C 140 F Do not disassemble crush puncture short external contacts or dispose of in fire or water Replace only with the spare designated for this product To remove the component 1 Power down the node on page 21 2 Remove the node from the chassis Remove a node from the chassis on page 22 3 Remove the access panel on page 23 4 Locate the battery on the sys...

Страница 46: ...M security rivet Upon locating a broken or disfigured rivet on an installed TPM administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data If you suspect a TPM board failure leave the TPM installed and remove the system board System board on page 38 Contact an HP authorized service provider for a replacement system board and TPM b...

Страница 47: ...allations troubleshoot problems and perform repair validation HP Insight Diagnostics Offline Edition performs various in depth system and component testing while the OS is not running To run this utility launch the SmartStart CD HP Insight Diagnostics Online Edition is a web based application that captures system configuration and other related data needed for effective node management Available i...

Страница 48: ...d HP Channel Partner for on site service if configured and available in your country The software is available in two variants HP Insight Remote Support Standard This software supports server and storage devices and is optimized for environments with 1 50 servers Ideal for customers who can benefit from proactive notification but do not need proactive service delivery and integration with a manage...

Страница 49: ... access cables underneath the personality board assembly see Personality board assembly on page 37 SATA cabling Internal power cabling The power cable routes over the HDD LED cable and SATA cables Connect and route the cables in the following order ...

Страница 50: ...nt LED cable under the SFF backplane power cable and the USB VGA cable Connect and route the cables in the following order 1 RPS cable and front LED cable bottom 2 SFF backplane power cable 3 USB VGA cable Front LED cabling WARNING Only authorized technicians trained by HP should attempt to replace this component ...

Страница 51: ...rder 1 RPS cable and front LED cable bottom 2 SFF backplane power cable secured in the plastic clip 3 USB VGA cable USB VGA cabling To access cables underneath the personality board assembly see Personality board assembly on page 37 The USB VGA cable routes on top of the SFF backplane power cable RPS cable and front LED cable Connect and route the cables in the following order 1 RPS cable and fron...

Страница 52: ...drive bay 1 2 Hard drive bay 2 3 Node release button 4 USB connectors 2 5 VGA connector Front panel LEDs and buttons Item Description Status 1 UID LED button Blue Activated Flashing blue System is being remotely managed or firmware update is in progress Off Deactivated 2 System Health LED Green Normal ...

Страница 53: ...by mode but power is still applied Off Power is not connected or power supply has failed Drive LED definitions Item LED Status Definition 1 Reserved 2 Activity ring Rotating green Drive activity Off No drive activity 3 Reserved 4 Reserved System board components Item Description 1 Power connector 2 Processor socket 2 3 RPS connector 4 Processor 1 DIMM slots 6 5 Reserved connector 6 SATA 1 connecto...

Страница 54: ...tor top 19 USB VGA connector 20 Personality board connector 21 TPM connector 22 Processor socket 1 23 Processor 2 DIMM slots 6 24 SFF backplane power connector 25 SATA connectors 2 26 Front panel USB VGA connector 27 VGA connector 28 Front LED connector DIMM slots DIMM slots are numbered sequentially 1 through 6 for each processor The supported AMP modes use the alpha assignments for population or...

Страница 55: ...tings and fixed disk partitions which causes a loss of data Diagnostic LEDs Position Position Function S7 S8 Diagnostic LEDs Off Off Port 85 Off On Port 84 On Off iLO NMI jumper The NMI jumper allows administrators to perform a memory dump before performing a hard reset Crash dump analysis is an essential part of eliminating reliability problems such as hangs or crashes in OSs device drivers and a...

Страница 56: ...scription 1 Hard drive power connector 2 RPS connector 3 Serial connector 4 LED cable connector 5 Power connector 6 NIC 1 connector 7 NIC 2 connector 8 iLO connector 9 x24 personality board assembly connector This connector is on the bottom of the personality board ...

Страница 57: ...e for sea level An altitude derating of 1 C per 300 m 1 8 F per 1 000 ft to 3 048 m 10 000 ft is applicable No direct sunlight allowed Storage maximum humidity of 95 is based on a maximum temperature of 45 C 113 F Altitude maximum for storage corresponds to a pressure minimum of 70 kPa Hot plug power supply calculations For hot plug power supply specifications and calculators to determine electric...

Страница 58: ...iations CSR Customer Self Repair HDD hard drive HP SIM HP Systems Insight Manager iLO Integrated Lights Out NMI nonmaskable interrupt RBSU ROM Based Setup Utility SAS serial attached SCSI SATA serial ATA SFF small form factor USB universal serial bus ...

Страница 59: ...oviding documentation that meets your needs To help us improve the documentation send any errors suggestions or comments to Documentation Feedback mailto docsfeedback hp com Include the document title and part number version number or the URL when submitting your feedback ...

Страница 60: ...equirements 57 F features 52 front panel board 36 front panel buttons 52 front panel components 52 front panel LEDs 52 H hard drive blanks 25 hard drive LEDs 53 hard drives determining status of 53 heatsink 28 HP Insight Diagnostics 47 HP Insight Remote Support software 48 I IML Integrated Management Log 47 Insight Diagnostics 47 Integrated Management Log IML 47 L LEDs 53 LEDs drive 53 LEDs front ...

Страница 61: ...3 serial connector 56 server installation 22 SFF backplane board 35 specifications 57 static electricity 23 symbols on equipment 24 system battery 45 system board components 54 system board replacement 38 T tools 21 TPM Trusted Platform Module 46 Trusted Platform Module TPM 46 U utilities 47 utilities deployment 47 W warnings 24 ...

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