Model
Replaceable Parts
ABBREVIATIONS (CONTINUED)
EMF
electromotive force
millihenry
PIN
TERM
EDP
mho
mho
negative
TFT
thin-film transistor
processing
MIN
=minimum
PIV
inverse voltage
TGL
toggle
ELECT
electrolytic
=minute (time)
peak
THD
=thread
=
encapsulated
minute (plane angle)
PL
THRU
through
EXT
external
=miniature
phase lock oscillator
TI
titanium
F
=
=
millimeter
PM
phase
TOL
tolerance
FET
MOD
modulator
PNP
positive-negative-
=
MOM
=
momentary
TSTR
FH
head
MOS
=
metal-oxide
part of
TTL
transistor-transislor
FOL H
head
conductor
POLY
FM
frequency modulation
=
PORC
porcelain
TV
FP
front panel
MTG
POS
TVI
FREQ
=
frequency
MTR
=meter
(used in parts list)
TWT
traveling wave tube
FXD
device)
POSN
(10
gram
POT
potentiometer
parts
GE
=
=
ac
=
peak-to-peak
(used
=millivolt, dc
PP
peak-to-peak (used
parts
GL
glass
=
peak
parts
UHF
ultrahigh frequency
GND
=
peak-to-peak
PPM
UNREG
unregulated
H
=henry
=
modulation
V
h
=hour
=
PREAMPL =
VA
HET
MUX
=
PRF
=
pulse-repelttion
=
HEX
=hexagonal
MY
=
mylar
frequency
VAR
=
variable
head
P A
=
PRR
pulse
rate
VCO
=
voltage-controlled
HDW
hardware
picosecond
HF
frequency
=
=
HG
mercury
=
micromho
PTM
=
modulation
VOCW
=
volts
(used
HI
=
=
pulse-width
parts
=
PWV
peak
voltage
=
HPF
pass
=
ac
RC
resistance capacitance
VFO
=
variable-frequency
HR
=hour (used in parts list)
=
RECT
HV
voltage
peak
REF
=
reference
VHF
=
very-high frequency
H
Z
=
peak-lo-
REG
regulated
volts peak
peak
REPL
replaceable
Vp-p
peak-lo-peak
ID
=
inside
=
RF
radio frequency
Vrms
IF
inlermediate frequency
RFI
radio frequency
VSWR
voltage
wave
inch
NC
connection
round head;
hand
=
voltage-luned
NIC
=
closed
RLC
resistance-inductance-
VTVM
vacuum-lube
=
NE
=
neon
capacitance
=
switched
INP
=input
NEG
RMO
rack mount only
W
=
INS
nanofarad
=
root-mean-square
INT
=
PL
plate
RND
=
round
WIV
voltage
=
normally open
ROM
read-only memory
WW
=
wirewound
NOM
rack and panel
=
NORM
=
normal
RWV
reverse
voltage
YIG
NPN
=
parameter
pound
negative
=
second (time)
impedance
LC
NPO
=
second (plane angle)
LED
diode
(zero temperature
slow-blow (fuse (used
LF
frequency
list)
NOTE
LG
=
long
NRFR
=
not recommended for
controlled
LH
left hand
replacement
All
the parts
LIM
NSR
not separately
selenium
Will be in
case.
LIN
taper (used
replaceable
SECT
parts
nanosecond
=
=
frequency
LK WASH = lockwasher
order by description
LO
low.
OD
LOG
logarithmic taper
OH
oval head
(used in parts
AMPL
operational
SNR
= signal-to-nose
ratio
OPT
=
=
LPF
=
low
MULTIPLIERS
throw
LV
=
low voltage
OX
oxide
SPG
m
=
meter
ounce
split ring
ohm
SPST
T
MAX
P
peak (used
pans
throw
G
giga
megohm
list)
mega
MEG
(used
PAM
pulse-amplitude
stainless steel
kilo
parts
STL
steel
da
deka
10
MET FLM
metal film
PC
=
SO
square
d
deci
10
MET OX
=
metal oxide
PCM
pulse-code
SWR
standing-wave
10
MF
pulse-count modulation
SYNC
=
microfared (used in
PDM
T
(slow-blow fuse)
micro
parts list)
modulation
TA
=
tantalum
10
MFR
manufacturer
TC
P
10
=
PH
phosphor bronze
10
megahertz
delay
a
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