3.
Remove the heat sink
(2)
.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
system board each time the heat sink is removed. Thermal paste is located on the processor
(1)
and the section of the heat sink that services it
(2)
. Thermal pads are located on the Northbridge
chip
(3)
and the section of the heat sink that services it
(4)
. Replacement thermal material is
included with all heat sink and system board spare part kits.
Reverse this procedure to install the heat sink.
64
Chapter 4 Removal and replacement procedures
Содержание 2533t - Compaq Mobile Thin Client
Страница 1: ...HP 2533t Mobile Thin Client Maintenance and Service Guide ...
Страница 4: ...iv Safety warning notice ...
Страница 8: ...viii ...
Страница 91: ...Where used One screw that secures the top cover to the base enclosure Torx T8M2 0 5 0 screw 83 ...
Страница 94: ...Where used 3 screws that secure the system board to the base enclosure 86 Chapter 7 Screw listing ...
Страница 102: ...RJ 11 modem Pin Signal 1 Unused 2 Tip 3 Ring 4 Unused 5 Unused 6 Unused 94 Chapter 8 Connector pin assignments ...
Страница 116: ......