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Rev. 2.50
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Rev. 2.50
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HT66F20/HT66F30/HT66F40/HT66F50/HT66F60
HT66FU30/HT66FU40/HT66FU50/HT66FU60
A/D Flash MCU with EEPROM
HT66F20/HT66F30/HT66F40/HT66F50/HT66F60
HT66FU30/HT66FU40/HT66FU50/HT66FU60
A/D Flash MCU with EEPROM
Pin Name
Function
OP
I/T
O/T
Pin-Shared Mapping
SDI
SPI Data inp�t
PRM0
ST
—
PA6 or PD2 or PB�
SDO
SPI Data o�tp�t
PRM0
—
CMOS PA5 or PD3 or PB6
SCS
SPI Slave Select
PRM0
ST
CMOS PB5 or PD0 or PD�
SCK
SPI Serial Clock
PRM0
ST
CMOS PA� or PD� or PD6
SCL
I
2
C Clock
PRM0
ST
NMOS PA� or PD� or PD6
SDA
I
2
C Data
PRM0
ST
NMOS PA6 or PD2 or PB�
SCOM0~SCOM3 SCOM0~SCOM3
SCOMC
—
SCOM PC0� PC�� PC6� PC�
OSC�
HXT/ERC pin
CO
HXT
—
PB�
OSC2
HXT pin
CO
—
HXT
PB2
XT�
LXT pin
CO
LXT
—
PB3
XT2
LXT pin
CO
—
LXT
PB4
RES
Reset inp�t
CO
ST
—
PB0
VDD
Power s�pply*
—
PWR
—
—
AVDD
ADC power s�pply*
—
PWR
—
—
VSS
Gro�nd**
—
PWR
—
—
AVSS
ADC gro�nd**
—
PWR
—
—
Note: I/T: Input type;
O/T: Output type
OP: Optional by configuration option (CO) or register option
PWR: Power;
CO: Configuration option; ST: Schmitt Trigger input
CMOS: CMOS output;
NMOS: NMOS output
SCOM: Software controlled LCD COM;
AN: Analog signal
HXT: High frequency crystal oscillator
LXT: Low frequency crystal oscillator
*: VDD is the device power supply while AVDD is the ADC power supply. The AVDD pin is bonded
together internally with VDD.
**: VSS is the device ground pin while AVSS is the ADC ground pin. The AVSS pin is bonded together
internally with VSS.
As the Pin Description Summary table applies to the package type with the most pins, not all of the above
listed pins may be present on package types with smaller numbers of pins.