BA45F56xx Wireless Transceiver Application
AN0571EN V1.00
12 / 14
November 5, 2020
Routing
Tracks with right angles will cause impedance discontinuities which can accumulate charge
with resulting discharge effects. As this can affect the PCB stability, 45 degree angles or arcs
should be used.
The distance between adjacent tracks should not be less than 6 mils.
The distance between tracks and through holes should not be less than 6 mils.
The distance between two adjacent holes should not be less than 6 mils.
The VCC and GND main tracks width should not be less than 12 mils.
Power lines must first pass through a bypass capacitor before reaching the device power pins.
The ground plane must be as complete as possible under the device. It is important not to have
any tracks under the device and matching circuits otherwise the RF performance may be
affected. Refer to Figure 11.
Figure 11. Recommended Poured Ground Diagram
VSS should be directly connected to the back ground plane of the device during the layout
stage. If space permits, it is recommended to connect all the way to the external ground (GND),
as shown in Figure 12.
Figure 12. Ground Pin Recommendations
The connections between the crystal and the device should be kept as short as possible. In order
to avoid affecting the power supply, a ground area must be laid under the wiring with no
crossing power or signal paths. The crystal and the power lines should be separated by a certain
distance or a ground line. Refer to Figure 13.