Space and airflow requirements
Space and airflow requirements
To allow for servicing and adequate airflow, observe the following space and airflow requirements when deciding where to install a rack:
Leave a minimum clearance of 63.5 cm (25 in) in front of the rack.
Leave a minimum clearance of 76.2 cm (30 in) behind the rack.
Leave a minimum clearance of 121.9 cm (48 in) from the back of the rack to the back of another rack or row of racks.
Hewlett Packard Enterprise servers draw in cool air through the front door and expel warm air through the rear door. Therefore, the
front and rear rack doors must be adequately ventilated to allow ambient room air to enter the cabinet, and the rear door must be
adequately ventilated to allow the warm air to escape from the cabinet.
CAUTION:
CAUTION: To prevent improper cooling and damage to the equipment, do not block the ventilation openings.
When vertical space in the rack is not filled by a server or rack component, the gaps between the components cause changes in airflow
through the rack and across the servers. Cover all gaps with blanking panels to maintain proper airflow.
CAUTION:
CAUTION: Always use blanking panels to fill empty vertical spaces in the rack. This arrangement ensures proper
airflow. Using a rack without blanking panels results in improper cooling that can lead to thermal damage.
The 9000 and 10000 Series Racks provide proper server cooling from flow-through perforations in the front and rear doors that
provide 64 percent open area for ventilation.
CAUTION:
CAUTION: When using a Compaq branded 7000 series rack, install the high airflow rack door insert (PN 327281-B21
for 42U rack, PN 157847-B21 for 22U rack) to provide proper front-to-back airflow and cooling.
CAUTION:
CAUTION:
If a third-party rack is used, observe the following additional requirements to ensure adequate airflow and to prevent
damage to the equipment:
Front and rear doors—If the 42U rack includes closing front and rear doors, you must allow 5,350 sq cm (830 sq in)
of holes evenly distributed from top to bottom to permit adequate airflow (equivalent to the required 64 percent
open area for ventilation).
Side—The clearance between the installed rack component and the side panels of the rack must be a minimum of 7
cm (2.75 in).
Space and airflow requirements
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Содержание ProLiant DL360 Gen10 Plus
Страница 8: ...Component identification Component identification 8...
Страница 24: ...DIMM slot locations DIMM slots are numbered sequentially 1 through 16 for each processor DIMM slot locations 24...
Страница 29: ...HPE Basic Drive LED definitions 29...
Страница 31: ...BIOS Platform Configuration RBSU Hot plug fans 31...
Страница 36: ...Operations Operations 36...
Страница 47: ...Remove the secondary PCI riser cage 47...
Страница 54: ...Accessing the Systems Insight Display 54...
Страница 55: ...Setup Setup 55...
Страница 73: ...Hardware options installation Hardware options installation 73...
Страница 108: ...Installing an 8SFF optical drive 108...
Страница 110: ...8 Route and connect the data cable 9 Route and connect the power cable Installing a 2SFF SAS SATA NVMe drive cage 110...
Страница 122: ...Secondary PCI riser options Secondary PCI riser options 122...
Страница 129: ...Full length Installing an expansion board in the secondary riser cage 129...
Страница 135: ...Installing a type a Smart Array storage controller option 135...
Страница 140: ...Processor and heatsink options Processor and heatsink options 140...
Страница 149: ...4 LFF 11 Connect the cable Installing the Systems Insight Display power module 149...
Страница 160: ...HPE Trusted Platform Module 2 0 Gen10 option HPE Trusted Platform Module 2 0 Gen10 option 160...
Страница 163: ...Installing and enabling the HPE TPM 2 0 Gen10 option Installing and enabling the HPE TPM 2 0 Gen10 option 163...
Страница 164: ...Installing the Trusted Platform Module board Installing the Trusted Platform Module board 164...
Страница 167: ...4 Proceed to Preparing the server for operation Installing the TPM board and cover 167...
Страница 173: ...Cabling Cabling 173...
Страница 177: ...Front power SID USB cabling Front I O cabling 177...
Страница 178: ...Storage cabling Storage cabling 178...
Страница 181: ...8SFF x4 2SFF backplanes to type p controller 8SFF x4 2SFF backplanes to type p controller 181...
Страница 182: ...8SFF x4 2SFF backplanes to type a and type p controllers 8SFF x4 2SFF backplanes to type a and type p controllers 182...
Страница 183: ...2SFF x4 backplane to primary NVMe riser 2SFF x4 backplane to primary NVMe riser 183...
Страница 186: ...8SFF x4 backplane to 2 port type p controller 8SFF x4 backplane to 2 port type p controller 186...
Страница 187: ...8SFF x4 backplane direct attach 8SFF x4 backplane direct attach 187...
Страница 188: ...8SFF SAS SATA backplane to embedded SATA 8SFF SAS SATA backplane to embedded SATA 188...
Страница 191: ...4LFF backplane to controllers 191...
Страница 192: ...Software and configuration utilities Software and configuration utilities 192...
Страница 221: ...Keeping the system current Keeping the system current 221...
Страница 234: ...Troubleshooting Troubleshooting 234...
Страница 238: ...Removing and replacing the system battery 238...
Страница 251: ...Support and other resources Support and other resources 251...