iv
10 Appendix B Component specifications ············································ 10-1
Processors ·························································································································· 10-1
DIMMs ································································································································ 10-2
HDDs and SSDs ··················································································································· 10-3
PCIe modules ······················································································································ 10-9
11 Appendix C Hot removal and managed hot removal of NVMe drives · 11-1
Prerequisites ················································································································· 11-2
Procedure ····················································································································· 11-2
Prerequisites ················································································································· 11-3