H3C MSR3610-X1, Руководство по установке

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2
Temperature and humidity
Make sure the temperature and humidity in the equipment room meet the requirements described
in
Table 2 .
•
Lasting high relative humidity can cause poor insulation, electricity leakage, mechanical
property change of materials, and metal corrosion.
•
Lasting low relative humidity can cause washer contraction and ESD and cause problems
including loose mounting screws and circuit failure.
•
High temperature can accelerate the aging of insulation materials and significantly lower the
reliability and lifespan of the device.
Table 2 Temperature and humidity requirements for the equipment room
Temperature Humidity
•
With a hard disk:
5°C to 40°C (41°F to 104°F)
•
Without a hard disk:
0°C to 45°C (32°F to 113°F)
5% to 95% (noncondensing)
Cleanliness
Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of
metal components and contact points, especially when indoor relative humidity is low. In the worst
case, electrostatic adsorption can cause communication failure.
Table 3 Dust concentration limit in the equipment room
Substance Concentration limit (particles/m
3
)
Dust particles
≤ 3 x 10
4
(No visible dust on desk in three days)
NOTE:
Dust particle diameter ≥ 5 µm
The equipment room must also meet limits on salts, acids, and sulfides to eliminate corrosion and
premature aging of components, as shown in
Table 4 .
Table 4 Harmful gas limits in the equipment room
Gas Max. (mg/m
3
)
SO
2
0.2
H
2
S 0.006
NH
3
0.05
Cl
2
0.01
Cooling system
The device uses left to right airflow for heat dissipation.