Cinterion
®
EMS31-US Hardware Interface Overview
1.1 Key Features at a Glance
8
EMS31_US_HIO_v00.103
2017-11-27
Confidential / Preliminary
Page 7 of 33
Interfaces
Module interface
Surface mount device with solderable connection pads (SMT application
interface). Land grid array (LGA) technology ensures high solder joint reli-
ability and allows the use of an optional module mounting socket.
For more information on how to integrate SMT modules see also
[3]
. This
application note comprises chapters on module mounting and application
layout issues as well as on SMT application development equipment.
2 serial interfaces
ASC0:
•
8-wire modem interface with status and control lines, unbalanced, asyn-
chronous
•
Default baud rate: 115,200 baud
•
Adjustable baud rates: 1,200 to 3,686,400
•
Supports RTS0/CTS0 hardware flow control.
•
Indication of incoming data/SMS on RING0 (can be used to wake up
host from power down modes)
ASC1 (shared with GPIO lines):
•
4-wire, unbalanced asynchronous interface
•
Default baud rate: 115,200 baud
•
Adjustable baud rates: 1,200 to 3,686,400bps
•
Supports RTS1/CTS1 hardware flow control
UICC interface
Supported SIM/USIM cards: 3V, 1.8V
Embedded UICC
Module is hardware prepared for an embedded UICC (MIM)
GPIO interface
20 pads of the application interface programmable as GPIO pads (17) or
GPO pads (3):
GP(I)Os can be configured as ASC0 andASC1
Programming is done via AT commands
Antenna interface pad
50
Ω
LTE antenna
Power on/off, Reset
Power on/off
Switch-on by hardware signal ON
Switch-off by AT command
Automatic switch-off in case of critical temperature and voltage conditions
Reset
Orderly shutdown and reset by AT command
Evaluation kit
Evaluation module
EMS31-US module soldered onto a dedicated PCB that can be connected
to an adapter in order to be mounted onto the DSB75.
DSB75
DSB75 Development Support Board designed to test and type approve
Gemalto M2M modules and provide a sample configuration for application
engineering. A special adapter is required to connect the EMS31-US evalu-
ation module to the DSB75.
Feature
Implementation