GSWP100W-EVBPA
GaN E-HEMT Wireless Power Transfer Evaluation Board
User’s Guide
_____________________________________________________________________________________________________________________
GSWP100W-EVBPA Rev 180529
© 2018 GaN Systems Inc.
www.gansystems.com 17
Please refer to the Evaluation Board/Kit Important Notice on page 26
Figure 16 •
Proper oscilloscope probe measurement technique
PA Performance without EMI filter
Power-on Procedure without EMI filter
•
An additional heatsink may be required. The PA heatplate is provided with threaded hole
locations that can be used to attach the heatsink to the heatplate with 4-40 screws. To ensure
excellent thermal conduction, apply thermal grease to the PA / heatsink interface before
screwing the units together. Enough thermal grease should be applied so that a small amount
extrudes on all four sides as the screws are tightened. Wipe the assembly clean.
•
Make sure jumpers JP43/JP44 are off
•
Solder the wires with the SMA connector to JP56.
•
Connector the load to JP56
•
Plug the 5V
DC
supply into JP35. Pin 1: positive. Pin 2: negative. Turn the supply on and set the
DC input voltage to 5V
•
Plug the HV supply into JP32. Pin 1: positive. Pin 2: negative. Turn the supply on and ramp the
voltage from 0V to 10V.
•
Monitor the test point voltage by comparing the power meter measurement to GaN Systems’
test data which is available in Appendix A.
•
If the measurements correlate, increase the HV supply to 28V
DC.
•
IMPORTANT: Ensure the 5V
DC
supply does not exceed 6V during testing.
