GSWP100W-EVBPA
GaN E-HEMT Wireless Power Transfer Evaluation Board
User’s Guide
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GSWP100W-EVBPA Rev 180529
© 2018 GaN Systems Inc.
www.gansystems.com 12
Please refer to the Evaluation Board/Kit Important Notice on page 26
thermal performance. For effective thermal management, a hole is cut out of the PCB to permit
access to the copper coins. The two GS61008Ps’ bottom side thermal pads are soldered directly onto
the copper coins on the bottom side of the PCB and the Gate, Drain and Source signals are routed on
the top side of the PCB. This set up provides an ultra-low thermal impedance from the die to the
copper coins.
Figure 13 •
Copper coins soldered beneath PCB and devices top PCB
Figure 14 •
Aluminum heatplate with housing for two copper coins.
Heatplate
PCB back side
