FujiFilm FinePix F30, Руководство по обслуживанию

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FinePix F30 Service Manual
RoHS lead-free compliance
Because this product is RoHS lead-free compliant, use the designated after-sales parts and the designated lead-free solder
when performing repairs.
<Background & Overview>
With the exception of parts and materials expressly excluded from the RoHS directive (*1), all the internal connections and
component parts and materials used in this product are lead-free compliant (*2) under the European RoHS directive.
*1: Excluded items (list of the main lead-related items)
• Lead included in glass used in fluorescent tubes, electronic components and cathode-ray tubes
• Lead in high-melting-point solder (i.e. tin-lead solder alloys that contain 85% lead or more)
• Lead in ceramic electronic parts (piezo-electronic devices)
• Mercury contained in fluorescent tubes is also excluded.
*2: Definition of lead-free
A lead content ratio of 0.1 wt% or less in the applicable locations (solder, terminals, electronic components, etc.)
<Reference>
RoHS:
The name of a directive issued by the European Parliament aimed at restricting the use of
certain designated hazardous substances included in electrical and electronic equipment.
Designated substances (6): Lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBBs) and
polybrominated diphenyl ether (PBDE)
<Lead-free soldering>
When carrying out repairs, use a designated lead-free solder, bearing in mind the differing work practices for conventional
solder (eutectic) and lead-free solder.
„ „ „ „ „ Differences in the soldering work for lead-free and eutectic solder
When the soldering work practices for eutectic solder and lead-free solder are compared, the main differences are as shown
below. In particular, when lead-free solder is used, the solder tends to be less workable than when eutectic solder is used.
Accordingly, the soldering techniques used must take that into account.
Difference
The solder starts melting later.
Poor wetting
Solder feed rate is difficult to control.
Wetting the insides of through holes is especially
difficult.
During repairs (or modifications) removing solder
from inside through holes is difficult.
There is serious carbonization of the soldering iron.
The surface is not glossy.
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Countermeasure
The initial melting point of lead-free solder is high, so you
have to get used to it.
Move the tip of the soldering iron around to heat the entire
connection to the melting temperature and assist wetting.
Use the solder (wire) diameter and soldering iron that are
best suited to connection being soldered.
First apply solder to the area immediately around the
through hold and then feed the solder into the hole.
Use a suitable wicking wire (with a suitable method and
heating) and a suction tool.
Either put solder onto the soldering iron tip after completing
the work, or turn the iron off frequently.
Learn to recognize the appearance of the surface.