Fuji Electric MT5F33743 Скачать руководство пользователя страница 9

MT5F33743

© Fuji Electric Co., Ltd. All rights reserved.

The guaranteed value of 

V

GE

for the IGBT module is generally up to 

±

20 V (Check the specifications 

for the exact guaranteed value). If a voltage that exceeds the guaranteed value (

V

GES

) is applied 

between the gate and emitter of the IGBT, the IGBT gate is susceptible to breakage. Therefore, make 

sure that the voltage applied between the gate and emitter does not exceed the guaranteed value. In 

particular, the control terminal for the IGBT gate and temperature sensing diode is extremely sensitive 

to static electricity. Therefore, make sure to observe the following cautions when handling the product.

1) When handling the module after unpacking, first make sure to discharge any static electricity that 

exists on the human body or clothing with a high-

resistance (about 1 MΩ) ground, and then perform 

the work on a grounded conductive mat.

2) For the IGBT module, since no electrostatic measures have been taken for the terminal after 

unpacking, do not directly touch terminal components (especially the control terminal), but handle 

the module using the package body.

3) When performing soldering work on the IGBT terminal, make sure to ground the tip of the soldering 

iron with an adequately low resistance to ensure that static electricity is not applied to the IGBT 

through soldering iron or solder bath leakage.

Furthermore, the IGBT is susceptible to breakdown if voltage is applied between the collector and 

emitter while the gate-emitter are in the open state.

The reason for this is shown in Fig. 5-11 where a change in collector potential causes the gate 

potential to rise due to the flow of current (i). As a result, the IGBT turns on, and collector current 

begins to flow, which in turn, could cause IGBT breakdown due to heat generation.

Furthermore, when the product is installed in a piece of equipment, the IGBT is susceptible to 

breakdown due to the above reasons when a voltage is applied to the main circuit while the gate circuit 

is broken or not operating normally (gate in the open state). In order to prevent this type of breakdown, 

it is recommended that a resistor (

R

GE

) of about 10 kΩ be installed between the gate and emitter.

6. Electrostatic Discharge Countermeasures and Gate Protection

5-9

Fig. 5-11 Gate charging from electric potential of collector

C(Collector)

E(Emitter)

G(Gate)

R

GE

i

I

C

Содержание MT5F33743

Страница 1: ...imum Junction Temperature Tvjmax 5 2 2 Short Circuit Protection 5 2 3 Over Voltage Protection and Safety Operation Area 5 2 4 Operation Condition and Dead Time Setting 5 7 5 Parallel Connections 5 8 6 Electrostatic Discharge Countermeasures and Gate Protection 5 9 7 ESD Conductive Foam 5 10 ...

Страница 2: ...ned in chapter 1 this IGBT module has on chip current detecting sensor Its function and characteristics are shown in chapter 8 So please use this on chip sensor for short circuit protection function suitably On the other because this IGBT module does not have corrector voltage detecting point on each arm desaturation type of short circuit protection method shall not be used to avoid any unexpected...

Страница 3: ...s to be within RBSOA on actual system like invertor If surge voltage is excess guaranteed RBSOA surge voltage shall be suppressed by adding snubber circuit by reducing stray inductance by tuning gate resistance and so on In addition when surge voltage is reduced by gate resistance it is able to be effective operating condition to independently tune the gate resistance of turn on and turn off respe...

Страница 4: ... of SOA of FWD part 3 3 Safety operation area SOA of FWD part As same as RBSOA of IGBT SOA of FWD part is also defined SOA of diode is defined as acceptable area of maximum power Pmax which is the product of current and voltage during reverse recovery operation Therefore any system shall be designed that locus of current and voltage during reverse recovery should be within SOA An example of SOA of...

Страница 5: ...tions which happen dynamic avalanche shall not be applied because there is possibility of IGBT destruction by turn off loss increase and latch up phenomenon There are many causes of dynamic avalanche like long wiring of main circuit To prevent this dynamic avalanche IGBT module shall be used within RBSOA condition at least 5 5 Fig 5 6 An example of dynamic avalanche waveform 150 VCC 500V IC 2000A ...

Страница 6: ...le of active clamp circuits In the circuits Zenner diode and a diode connected with the anti series in the Zenner diode are added When the VCE over breakdown voltage of Zenner diode is applied IGBT will be turned off with the similar voltage as breakdown voltage of Zenner diode FWD Zenner Di Di IGBT Therefore installing the active clamp circuits can suppress the spike voltage Moreover avalanche cu...

Страница 7: ...ns under the maximum rated G E voltage VGES 20V 2 It is recommended that supply voltage fluctuations are kept to within 10 3 IGBT turn off characteristics are heavily dependent on VGE especially when the collector current is just beginning to switch off Consequently the greater the VGE the shorter the switching time and the switching loss become smaller 4 If the VGE is too small dv dt shoot throug...

Страница 8: ...cessary to consider other drive conditions and the temperature characteristics It is important to be careful with dead times that are too short because in the event of a short circuit in the upper or lower arms the heat generated by the short circuit current may destroy the module Therefore appropriate dead time should be settled by the confirmation of practical machine Fig 5 10 Dead time timing c...

Страница 9: ...le the module using the package body 3 When performing soldering work on the IGBT terminal make sure to ground the tip of the soldering iron with an adequately low resistance to ensure that static electricity is not applied to the IGBT through soldering iron or solder bath leakage Furthermore the IGBT is susceptible to breakdown if voltage is applied between the collector and emitter while the gat...

Страница 10: ... product in a piece of equipment it is requested that you only remove the conductive foam just before PCB mounting in order to prevent electrostatic discharge damage Refer to the following workflow 7 ESD Conductive Foam 5 10 4 PCB mounting and control terminal soldering 3 Conductive foam removal Fig 5 12 Conductive foam removal procedures 1 Unpacking 2 Moving process Do not remove the conductive f...

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