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MT5F33743

4. Operation Condition and Dead Time Setting

© Fuji Electric Co., Ltd. All rights reserved.

Since principal characteristics of IGBT depend on driving conditions like 

V

GE

and 

R

G

, certain setting

according to target design is needed. Gate bias condition and dead time setting are described here.

4.1 Forward bias voltage : +

V

GE

(on state)

Notes when +

V

GE

is designed are shown as follows.

(1) Set +

V

GE

so that is remains under the maximum rated G-E voltage, 

V

GES

=

±

20V.

(2) It is recommended that supply voltage fluctuations are kept to within 

±

10%.

(3) The on-state C-E saturation voltage 

V

CE(sat)

is inversely dependent on +

V

GE

, so the greater the

+

V

GE

the smaller the 

V

CE(sat)

.

(4) Turn-on switching time and switching loss grow smaller as +

V

GE

rises.

(5) At turn-on (at FWD reverse recovery), the higher the +

V

GE

the greater the likelihood of surge

voltages in opposing arms.

(6) Even while the IGBT is in the off-state, there may be malfunctions caused by the d

v

/d

t

of the

FWD’s reverse recovery and a pulse collector current may cause unnecessary heat generation.
This phenomenon is called a d

v

/d

t

shoot through and becomes more likely to occur as +

V

GE

rises.

(7) The greater the +

V

GE

the smaller the short circuit withstand capability.

4.2 Reverse bias voltage : -

V

GE

(off state)

Notes when -

V

GE

is designed are shown as follows.

(1) Set -

V

GE

so that it remains under the maximum rated G-E voltage, 

V

GES

=

±

20V .

(2) It is recommended that supply voltage fluctuations are kept to within 

±

10%.

(3) IGBT turn-off characteristics are heavily dependent on -

V

GE

, especially when the collector current

is just beginning to switch off. Consequently, the greater the -

V

GE

the shorter, the switching time

and the switching loss become smaller.

(4) If the -

V

GE

is too small, d

v

/d

t

shoot through currents may occur, so at least set it to a value

greater than -5V. If the gate wiring is long, then it is especially important to pay attention to this.

5-7

Fig. 5-9 Principle of unexpected turn-on 

In this section, the way to avoid the unexpected

IGBT turn-on by d

v

/d

t

at the FWD’s reverse recovery

will be described.

Fig. 5-9 shows the principle of unexpected turn-on

caused by d

v

/d

t

at reverse recovery. In this figure, it

is assumed that IGBT

1

is turned off to on and gate to

emitter voltage 

V

GE

of IGBT

2

is negative biased. In

this condition, when IGBT

1

get turned on from

off-state, FWD on its opposite arm, that is, reverse

recovery of FWD

2

is occurred. At same time, voltage

of IGBT

2

and FWD

2

with off-state is raised. This

causes the d

v

/d

t

according to switching time of

IGBT

1

. Because IGBT

1

and IGBT

2

have the mirror

capacitance 

C

res

, Current is generated by d

v

/d

t

through 

C

res

. This current is expressed by 

C

res

x

d

v

/d

t

. This current is flowed through the gate resistance 

R

G

, results in increasing the gate potential.

4.3 Avoid the unexpected turn-on by recovery d

v

/d

t

IGBT

1

IGBT

2

FWD

2

FWD

1

R

G

R

G

Off state

i

C

res

×

d

v/

d

t

Содержание MT5F33743

Страница 1: ...imum Junction Temperature Tvjmax 5 2 2 Short Circuit Protection 5 2 3 Over Voltage Protection and Safety Operation Area 5 2 4 Operation Condition and Dead Time Setting 5 7 5 Parallel Connections 5 8 6 Electrostatic Discharge Countermeasures and Gate Protection 5 9 7 ESD Conductive Foam 5 10 ...

Страница 2: ...ned in chapter 1 this IGBT module has on chip current detecting sensor Its function and characteristics are shown in chapter 8 So please use this on chip sensor for short circuit protection function suitably On the other because this IGBT module does not have corrector voltage detecting point on each arm desaturation type of short circuit protection method shall not be used to avoid any unexpected...

Страница 3: ...s to be within RBSOA on actual system like invertor If surge voltage is excess guaranteed RBSOA surge voltage shall be suppressed by adding snubber circuit by reducing stray inductance by tuning gate resistance and so on In addition when surge voltage is reduced by gate resistance it is able to be effective operating condition to independently tune the gate resistance of turn on and turn off respe...

Страница 4: ... of SOA of FWD part 3 3 Safety operation area SOA of FWD part As same as RBSOA of IGBT SOA of FWD part is also defined SOA of diode is defined as acceptable area of maximum power Pmax which is the product of current and voltage during reverse recovery operation Therefore any system shall be designed that locus of current and voltage during reverse recovery should be within SOA An example of SOA of...

Страница 5: ...tions which happen dynamic avalanche shall not be applied because there is possibility of IGBT destruction by turn off loss increase and latch up phenomenon There are many causes of dynamic avalanche like long wiring of main circuit To prevent this dynamic avalanche IGBT module shall be used within RBSOA condition at least 5 5 Fig 5 6 An example of dynamic avalanche waveform 150 VCC 500V IC 2000A ...

Страница 6: ...le of active clamp circuits In the circuits Zenner diode and a diode connected with the anti series in the Zenner diode are added When the VCE over breakdown voltage of Zenner diode is applied IGBT will be turned off with the similar voltage as breakdown voltage of Zenner diode FWD Zenner Di Di IGBT Therefore installing the active clamp circuits can suppress the spike voltage Moreover avalanche cu...

Страница 7: ...ns under the maximum rated G E voltage VGES 20V 2 It is recommended that supply voltage fluctuations are kept to within 10 3 IGBT turn off characteristics are heavily dependent on VGE especially when the collector current is just beginning to switch off Consequently the greater the VGE the shorter the switching time and the switching loss become smaller 4 If the VGE is too small dv dt shoot throug...

Страница 8: ...cessary to consider other drive conditions and the temperature characteristics It is important to be careful with dead times that are too short because in the event of a short circuit in the upper or lower arms the heat generated by the short circuit current may destroy the module Therefore appropriate dead time should be settled by the confirmation of practical machine Fig 5 10 Dead time timing c...

Страница 9: ...le the module using the package body 3 When performing soldering work on the IGBT terminal make sure to ground the tip of the soldering iron with an adequately low resistance to ensure that static electricity is not applied to the IGBT through soldering iron or solder bath leakage Furthermore the IGBT is susceptible to breakdown if voltage is applied between the collector and emitter while the gat...

Страница 10: ... product in a piece of equipment it is requested that you only remove the conductive foam just before PCB mounting in order to prevent electrostatic discharge damage Refer to the following workflow 7 ESD Conductive Foam 5 10 4 PCB mounting and control terminal soldering 3 Conductive foam removal Fig 5 12 Conductive foam removal procedures 1 Unpacking 2 Moving process Do not remove the conductive f...

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