MT6M15589
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6. Heat sink selection
This chapter describes the heat sink selection for the product (Small IPM).
6-1
• Please make sure that the junction temperature Tj should not exceed the maximum junction
temperature Tj(max) for safe operation. Cooling device (heat sink) should be designed to ensures
that Tj is always below Tj(max).
• If the IGBT or FWD junction temperature is higher than Tj(max), it might cause damage to the chips.
Some types of the Small-IPM have the over-heating (OH) protection function which works when the
IGBT junction temperature exceeds Tj(max). However, if the temperature rises too quickly, the OH
protection might not work.
• When selecting a cooling device (heat sink), please verify the chip temperature Tj by measuring Tc
at the position shown in Figure 6-1, and calculating the Tj from device power dissipation and
thermal resistance. In addition, this product has a built-in temperature sensor, and Tj can be
confirmed by the analog voltage that is output according to the LVIC chip temperature. Please refer
to it when selecting the cooling device (heat sink).
• For more detail design, please refer “IGBT Module Application Manual (REH984c)” and “Small IPM
Application Manual (MT6M12343)”.
1
Selection
A
pp
ro
x.
4.
5
A
pp
ro
x.
0.
7
Approx. 7.0
TOP VIEW
SIDE VIEW
Heat sink side
Tc measurement position
Temperature sensor position
Approx. 6.3
Fig. 6-1 Temperature sensing and Tc measurement points
