MT6M15589
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3. Through hole design for PCB
This chapter describes the through hole design for PCB attaching to the product (Small IPM).
3-1
Figures 3-1 to 3-4 show examples of recommended through hole dimensions and through hole layout
designs.
• The through hole dimensions are the inner diameter after plating (dimension unit: mm).
• If the terminal cross-sectional dimensions / through hole clearance is too large, solderability may be
impaired. Also, if the land diameter is too large, solder bridges are likely to occur.
• The hole size and land size should be optimized as appropriate, taking into consideration the printed
circuit board processing accuracy and mounting method.
Fig. 3-4 Through hole layout with
zigzag pattern terminal
Fig. 3-1 Control side through hole
dimensions
Through hole
Land
Fig. 3-2 Power side through hole
dimensions
Through hole
Land
Fig. 3-3 Through hole layout with standard
terminals and short terminals
F2
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