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MT6M15589

• When using spacer between the PCB and the Small IPM for alignment during soldering to printed

circuit board, it is recommended to support the Small IPM at the hatched area as shown in Fig. 4-1.

• The spacer should be made of resin or metal, and select a material that does not cause

contamination or corrosion.

4. Spacer

This chapter describes the spacer for PCB attaching to the product (Small IPM).

4-1

Fig. 4-1 Spacer installation position (recommended)

Содержание 6MBP XS 060-50 Series

Страница 1: ...MT6M15589 Mounting Instruction Fuji Small IPM Intelligent Power Module P633A series 6MBP XS 060 50 15th of June 2020 Rev 0...

Страница 2: ...jury fire or other problem if any of the products become faulty It is recommended to make your design failsafe flame retardant and free of malfunction The products introduced in this Instruction are i...

Страница 3: ...in writing from Fuji Electric Co Ltd If you have any question about any portion in this Instruction ask Fuji Electric Co Ltd or its sales agents before using the product Neither Fuji Electric Co Ltd...

Страница 4: ...ng out the Small IPM from the stick 2 3 Chapter 3 Through hole design for PCB 3 1 Chapter 4 Spacer 4 1 Chapter 5 Compound application 5 1 Chapter 6 Heat sink selection 6 1 1 Selection 6 1 2 Shape 6 2...

Страница 5: ...rm the outer box shall be avoid even when it is packed in the outer box Transport the cardboard box with the appropriate side facing up Otherwise unexpected stress may be applied to the Small IPM whic...

Страница 6: ...removing the pin The recoil of removing the pins may cause deformation or damage to the terminals of the Small IPM so remove the pins with holding them If the product falls out from the tube when rem...

Страница 7: ...insert the remover removal part as shown in Figure 2 2 See Fig 2 3 Removal part Fig 2 2 Example of remover removal jig Gap Fig 2 1 Gap between the pin and the Small IPM Gap Fig 2 3 Gap between the pin...

Страница 8: ...are necessary in the assembly environment within the range described in the specifications In particular when picking it out from the tube it may cause the most electrical damage to the product When...

Страница 9: ...sions through hole clearance is too large solderability may be impaired Also if the land diameter is too large solder bridges are likely to occur The hole size and land size should be optimized as app...

Страница 10: ...rcuit board it is recommended to support the Small IPM at the hatched area as shown in Fig 4 1 The spacer should be made of resin or metal and select a material that does not cause contamination or co...

Страница 11: ...compound coating amount that can absorb the strain due to the difference in thermal expansion when the temperature gradient is large In the case of a multiple structure heat sink the number of fasten...

Страница 12: ...e temperature rises too quickly the OH protection might not work When selecting a cooling device heat sink please verify the chip temperature Tj by measuring Tc at the position shown in Figure 6 1 and...

Страница 13: ...flatness 100mm External Heat sink As shown in Fig 6 2 the heat sink flatness should be from 0 m 100mm to 100 m 100mm and the surface roughness Rz should be less than 10 m If the heat sink surface is c...

Страница 14: ...dering iron 260 5 10 1sec b Solder dipping Soldering iron 350 10 3 5 0 5sec Table 7 1 Soldering temperature and duration A stopper is provided on the terminal to prevent the immersion depth of the ter...

Страница 15: ...Small IPM 8 1 1 Stencil mask drawing for thermal compound application recommended Package No P633A Metal mask thickness T 150 m Target compound thickness T approx 75 m Aluminum base centerline This f...

Страница 16: ...nd the heat sink the isolation voltage will be 2 5 kVrms By processing the heat sink as follows it is possible to secure a clearance distance of 5 08 mm or more in accordance with UL508C table 36 3 st...