4. POWER AMPLIFIER FOR GSM850 / DCS1800 / PCS1900
4.1 Block Diagram and Description
The SKY77328 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm),
compact form factor for quad-band cellular handsets comprising GSM850, DCS1800, and
PCS1900 operation. The PAM also supports Class 12 General Packet Radio Service (GPRS)
multi-slot operation.
The module consists of separate GSM850 PA and DCS1800/PCS1900 PA blocks,
impedance-matching circuitry for 50 Ω input and output impedances, and a Power
Amplifier Control (PAC) block with an internal current-sense resistor. The custom BiCMOS
integrated circuit provides the internal PAC function and interface circuitry. Fabricated
onto a single Gallium Arsenide (GaAs) die, one Heterojunction Bipolar Transistor (HBT) PA
block supports the GSM850 bands and the other supports the DCS1800 and PCS1900 bands.
Both PA blocks share common power supply pins to distribute current. The GaAs die, the
Silicon (Si) die, and the passive components are mounted on a multi-layer laminate
substrate. The assembly is encapsulated with plastic overmold.
RF input and output ports of the SKY77328 are internally matched to a 50 Ω load to reduce
the number of external components for a quad-band design. Extremely low leakage current
(2.5 µA, typical) of the dual PA module maximizes handset standby time. The SKY77328
also contains band-select switching circuitry to select GSM (logic 0) or DCS/PCS (logic 1)
as determined from the Band Select (BS) signal. In Figure 1 below, the BS pin selects the
PA output (DCS/PCS OUT or GSM850 OUT) and the Analog Power Control (VAPC) controls
Содержание SP-770
Страница 1: ...SP 770 AS Manual GSM GPRS Cellular Phone SKYSPRING VITELCOM...
Страница 6: ...SECTION1 SP 770 PRODUCT OVERVIEW...
Страница 27: ...Figure4 Battery Charger Flow chart...
Страница 36: ...SECTION2 SCHEMATIC LAYOUT 1 MAIN PART SCHEMATIC LAYOUT 1 1 BASEBAND PART...
Страница 37: ...1 2 MMI PART...
Страница 38: ...1 3 RF PART...
Страница 39: ...2 MAIN KEY PART SCHEMATIC LAYOUT...
Страница 40: ...3 LCD...
Страница 41: ...SECTION3 PCB LAYOUT 1 MAIN PCB 1 1 Location Map of Main PCB Top...
Страница 42: ...1 2 Location Map of Main PCB Bottom...
Страница 43: ...2 MAIN KEY PCB 2 1 Location Map of Main KEY PCB Top...
Страница 44: ...2 2 Location Map of Main KEY PCB Bottom...
Страница 45: ...3 LCD PCB...
Страница 46: ...SECTION4 MECHANICAL ASSEMBLY...
Страница 48: ...3 LOGIC PART TROUBLESHOOTING...
Страница 50: ...3 2 Troubleshooting 2 LCD Display Backlight error...
Страница 51: ...3 3 Troubleshooting 3 Key push error...
Страница 52: ...3 4 Troubleshooting 4 Vibrator error...
Страница 53: ...3 5 Troubleshooting 5 MP3 Play error...
Страница 54: ...3 6 Troubleshooting 6 Camera Preview error...
Страница 55: ...3 7 Troubleshooting 7 FM Radio Play error...
Страница 57: ...3 9 Troubleshooting 9 Bluetooth error...
Страница 58: ...4 RF PART TROUBLESHOOTING...
Страница 59: ...4 1 Troubleshooting 10 RX path check...
Страница 60: ...4 2 Troubleshooting 11 TX path check...
Страница 64: ...4 Settings 4 1 Flash Tool setting 1 Firstly Check values of the setting in an Options menu...
Страница 66: ...5 SW Downloading 1 Connect LT cable to the PC 2 Press the Download button...
Страница 67: ...3 Connect LT cable to the target mobile phone with power off 4 Completion of downloading...
Страница 74: ...5 4 Save back up NVRAM data as a file Save back up NVRAM data from target as a file...
Страница 77: ...6 4 Download to flash Click download to flash button and then updating parameters is complete...