KIC551
K I C 5 5 1 U s e r M a n u a l
42
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3.6.1 Requirements to the cooling system of the KIC551 module
The module should operate within the specified temperature ranges (subparagraph
1.2 Technical
Feaures of KIC551/KIC551RC, Table 3.3
) with the forced air cooling as part of the chassis. The
total power dissipated by PCI Express and Gigabit Ethernet switches as well as by 10 Gbit
Ethernet network controller is ~50 W. Preliminary thermal calculation of the cooling system is
recommended. The values of dissipated power and microchip limit temperatures are shown in
Table 3.5.
Table 3.5
– Dissipated power and limit temperatures of microchips
Attention!
For all the KIC551 modules, forced cooling is mandatory, therefore, it is strongly recommended for
the users to use the chassis with integrated units for air cooling of internal space for systems
based on KIC551.
Attention!
It is recommended to use standard fans (crates manufactured by Schroff) in the systems based on
KIC551 interface modules.
3.6.2 Requirements to the cooling system of the KIC551RC module
KIC551RC should function within the specified temperature ranges (subparagraph
1.2 Technical
Feaures of KIC551/KIC551RC, Table 3.4)
.
Conduction-type coller for the KIC551RC module, in addition to the thermal extraction sources
stated in subparagraph 3.6.1, is capable of efficiently withdraw heat from all active components of
the units of elements of the module with heat extraction of more than 300 mW. This enables you to
keep the temperature within the inner volume of the plate at an acceptable level. For proper
operation of the heat removal plate, the design of the enclosure must provide such a heat
dissipation so that the temperature at the control point of the heat removal plate does not go
beyond the limits indicated in Table. 3.6.
Table 3.6
– Temperature range (in the reference point of the heat removal plate of KIC551RC)
KIC551RC interface module
KIC551RC-01
Temperature range: from -
50 ÷ +85 °C
KIC551RC-02
Temperature range: from -
50 ÷ +85 °C
Location of the reference point on the heat removal plate is defined in accordance with the Fig.3.1.
Microchip
Dissipated power (W)
Limit temperature of the
microchip(°C)
PCI-E Switch
30
125
10 Gigabit Ethernet Controller
10
110
Gigabit Ethernet Switch
4,5
110
