Fastwel DIC324, Руководство пользователя

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User Manual
DIC324
Table of contents
Table of contents 3
Trademarks 5
Ownership Rights 5
Notation Conventions 6
Safety Requirements 7
High Voltage Safe Handling Rules 7
Board Handling Regulations 7
General Board Operation Rules 8
MANUFACTURER'S WARRANTIES 9
1 Introduction 10
1.1 Module technical features ........................................................................................................................... 10
1.2 Versions ...................................................................................................................................................... 11
1.3 Module delivery checklist ............................................................................................................................ 12
1.4 External view and location of components 12
1.4.1 Module external view ................................................................................................................. 13
1.4.2 Overall and mounting dimensions, location of main components .............................................. 14
2 Functional description 15
2.1 Module block diagram ................................................................................................................................. 15
2.2 Location of main components ..................................................................................................................... 16
2.3 Module's functional nodes and interfaces ................................................................................................... 17
2.3.1 Base FPGA (BASE) ................................................................................................................... 17
2.3.2 System ISA bus ......................................................................................................................... 17
2.3.3 Digital input ports (Digital_Inputs) .............................................................................................. 19
2.3.4 Input channel diagram ............................................................................................................... 20
2.3.5 Resistive assemblies ................................................................................................................. 21
2.3.6 Digital output port (Digital_Outputs) ........................................................................................... 21
2.3.7 Solid state relay ......................................................................................................................... 23
2.3.8 Base address switch .................................................................................................................. 24
2.3.9 LEDs .......................................................................................................................................... 24
2.3.10 Module power supply ................................................................................................................. 24
3 Module use ........................................................................................................................................... 25
3.1 Module preparation for use ......................................................................................................................... 25
3.1.1 General requirements ................................................................................................................ 25
3.1.2 Electrostatic safety requirements .............................................................................................. 25
3.1.3 External inspection .................................................................................................................... 25
3.1.4 Readiness check ....................................................................................................................... 26
3.1.5 Installation of DIC324................................................................................................................. 26
3.1.6 Module's default configuration ................................................................................................... 26
3.1.7 Connection to the module .......................................................................................................... 27
3.1.8 Module configuration.................................................................................................................. 27
3.2 Main control capabilities ............................................................................................................................. 27
3.2.1 Setting base address ................................................................................................................ 27
3.2.2 Jumpers for the installation of input signal connection type ....................................................... 29
3.2.3 Setting the range of input voltages ............................................................................................ 32
3.2.4 Jumpers for the installation of switching load type ..................................................................... 32
3.3 Description of registers and D11 user configuration ................................................................................... 34
3.3.1 FPGA D11 configuration
– Digital_Inputs .................................................................................. 34
3.3.1.1 Integrated parts of the diagram ................................................................................. 35
3.3.2 Configuration FPGA D11 - Digital_Outputs ................................................................................ 39
3.3.2.1 Integrated parts of the diagram ................................................................................. 39
3.3.2.2 Purpose of output ports ............................................................................................. 39
3.3.3 Module identification .................................................................................................................. 40
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