CPC1001
C P C 1 0 0 1 U s e r M a n u a l
26
© 2 0 2 1 F a s t w e l V e r . 0 0 1
For long-term failsafe operation, the temperature of the CPU module, measured on its enclosure or
on the heat-distribution plate (the recommended temperature measurement zone is shown in Fig.
2.2), should not
95 °C under all permissive external conditions.
If the natural heat dissipation is insufficient, a heatsink should be used (it is recommended to install
the heatsink using a thermal paste) and, if necessary, a fan should also be used, the requirements
for which are determined based on the operating features, with due consideration to the
information given above. If the CPC1001-01 module is used, the heatsink is fastened to the heat-
distribution plate with four M3 screws in the corresponding holes (see Fig. 2.2).
Attention!
The maximum permissible depth of securing the screws into the M3 holes of the heatsink of the
CPC1001-01 module (Fig. 2.2) is 4 mm.
2.5 Installation of CPC1001
The carrier board for the CPC1001 must comply with the SMARC specification version 1.1 subject
to the compatibility restrictions specified in the
Note
given in subparagraph 1.6.2.
Information on mating connectors of the carrier board and standoffs recommended to installation of
CPC1001 is given in the table 2.1
2
Measurement error may be up to
±6 °C.
3
Thresholding method depends on the operating system used.