SED1751
MLS Driver Chip Set
EPSON
5–1
Technical Manual
OVERVIEW
Description
The SED1751 is an 120 output, 3-level low-resistance common (row) driver suitable for high-quality,
high-response-speed MLS (Multi Line Selection) driving.
The SED1751 receives signals from LCD controllers such as the SED1335, and when used is used in
conjunction with the SED1580, can be used to structure a 4-line MLS drive.
The SED1751 uses a slim-chip form that is useful for making LCD panels slimmer. It also supports reduced
logic system voltage operation, making it suitable for a broad range of applications.
The SED1751 has a pad layout supporting easy mounting, and supports bi-directional selection of driver
output order, and has the highest use efficiency for 1/240 and 1/480 duty panels.
Features
•
LCD driver outputs ...................................... 120
•
Low output ON resistance
•
High duty drive supported ........................... 1/480 (Reference value)
•
Broad range of LC drive voltages ............... + 14 to + 42 V (V
CC
= 2.7 to 5.5 V)
•
Output shift direction pin select is possible
•
Can be switched between 100 and 120 outputs
•
Non-biased display OFF function
•
Logic system power source ......................... 2.7 V to 5.5 V
•
LC power source offset bias can be adjusted relative to the V
DDH
and GND levels
•
Slim chip shape
•
D
0B
.............................................................. Au Bump die
•
T
0A
............................................................... TCP
Pad Layout
Y
X
131
1
132
155
60
35
59
36
Chip size
12.19 mm
×
2.38 mm
Pad pitch
80
µ
m (Min.)
Chip thickness
525
µ
m
±
25
µ
m
1) Au Bump Specifications (SED1751D
OB
) Reference Values Only
Au vertical bump
Parallel to Scribe
×
Perpendicular to Scribe
±
Tolerance
Bump Size A
60
µ
m
×
75
µ
m
±
4
µ
m (Pad No. 1 to 35, 60 to 131)
Bump Size B
80
µ
m
×
50
µ
m
±
4
µ
m (Pad No. 36 to 59, 132 to 155)
Bump height
17 to 28
µ
m (The details specified in the acceptance specifications.)
Содержание SED1751
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