SED1751
MLS Driver Chip Set
EPSON
5–15
Technical Manual
Example of External Connections
(Rear surface should be P1 coated.)
(Rear surface should be P1 coated.)
(Rear surface
should be
P1 coated.)
Detail drawing for the test pad section
Output terminal pattern shape
Specifications :
Base : Eupirex-S? , 75?u?m
Copper foil : 31P (14.25mm)
Sn plated
Product pitch : 31P (14.25mm)
Solder resist position tolerance :
±
0.3
(Molding range)
(Molding range)
(Rear surface should
be P1 coated.)
(Molding range)
(Molding range)
Содержание SED1751
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