Epson S1D16000 Series, Техническое руководство

Страница: 74 / 86

S1D16702 Series
Rev.1.0
EPSON
5–5
PAD PIN
X Y
NO. NAME
PAD PIN
X Y
NO. NAME
PAD PIN
X Y
NO. NAME
61 COM 56 –195 1357
62 COM 57 –324
63 COM 58 –453
64 COM 59 –583
65 COM 60 –712
66 COM 61 –841
67 COM 62 –970
68 COM 63 –1099
69 COM 64 –1229
70 COM 65 –1358
71 COM 66 –1487
72 DM –1616 1357
73 DM –1865 1201
74 COM 67 1071
75 DIO2 941
76
INH
715
77 FR 585
78 YSCL 455
79 SHL 325
80 V
DD
195
81 V
SS
55
82 V
0
–112
83 V
1
–252
84 V
4
–391
85 V
5
–531
86 DIO1 –671
87 COM 0 –810
88 COM 1 –941
89 COM 2 –1071
90 DM –1865 –1201
1 DM –1579 –1357
2 COM 3 –1449
3 COM 4 –1320
4 COM 5 –1191
5 COM 6 –1062
6 COM 7 –933
7 COM 8 –803
8 COM 9 –674
9 COM 10 –545
10 COM 11 –416
11 COM 12 –287
12 COM 13 –154
13 COM 14 –28
14 COM 15 101
15 COM 16 230
16 COM 17 359
17 COM 18 489
18 COM 19 618
19 COM 20 747
20 COM 21 876
21 COM 22 1005
22 COM 23 1135
23 COM 24 1264
24 COM 25 1393
25 COM 26 1522
26 DM 1651
27 DM 1781 –1357
28 DM 1976 –1098
29 COM 27 1976 –969
30 COM 28 1976 –840
31 COM 29 1976 –711
32 COM 30 –581
33 COM 31 –452
34 COM 32 –323
35 COM 33 –194
36 COM 34 –65
37 COM 35 65
38 COM 36 194
39 COM 37 323
40 COM 38 452
41 COM 39 581
42 COM 40 711
43 COM 41 840
44 COM 42 969
45 DM 1976 1098
46 DM 1743 1357
47 DM 1614
48 COM 43 1485
49 COM 44 1355
50 COM 45 1226
51 COM 46 1097
52 COM 47 968
53 COM 48 839
54 COM 49 709
55 COM 50 580
56 COM 51 451
57 COM 52 322
58 COM 53 193
59 COM 54 63
60 COM 55 –66 1357
Chip size: 4.27
×
3.03 mm
Chip thickness: 400
µ
m (for AL pad product) and 525
µ
m (for BUMP product).
AL pad product: Pad opening is 100
×
100
µ
m.
BUMP product: Vertical Au bump.
Bump size is 90
×
90
µ
m.
Bump height is 17 to 25
µ
m.
1 27
72
Y
X
(0,0)
46
28
45
90 DieNo.
73
PAD No. 76: INH for S1D16702
*
00
**
DOFF for S1D16702
*
01
**
*1
*1
Á
Pad center coordinates
6. PAD
Á
Pad layout
www.DataSheet4U.com