S1D16700 Series
4–4
EPSON
Rev. 1.1
Y
X
112
1
36
37
57
93
56
92
(0,0)
Chip size ............................ 5.49mm
×
3.03mm
Chip thickness .................... 525
µ
m (Au-bump die from)
400
µ
m (Al-Pad die from)
1) Au bump specification reference values
Bump specific : High Quarity Au bump
Bump size :
90
µ
m
×
90
µ
m
Bump height :
17
µ
m
∼
28
µ
m
2) AL Pad specification reference values
Pad Opening :
100
µ
m
×
100
µ
m
5. PAD
Á
Pad layout
www.DataSheet4U.com
Содержание S1D16000 Series
Страница 5: ...Selection Guide www DataSheet4U com ...
Страница 7: ...S1D16006 Series Rev 2 1 www DataSheet4U com ...
Страница 23: ...S1D16400 www DataSheet4U com ...
Страница 38: ...S1D16501 Rev 1 0 www DataSheet4U com ...
Страница 53: ...S1D16700 Rev 1 1 www DataSheet4U com ...
Страница 68: ...S1D16702 Rev 1 0 www DataSheet4U com ...