S1D16501 Series
3–4
EPSON
Rev.1.0
109
110
119
29
20
30
19
1
Y
X
a
a
c
c
a
b
b
b
152µm-
α
170µm-
α
475µm
152µm-
α
153µm
130µm
144µm
(Min)
(Min)
(Min)
Chip edge
Chip edge
Pad
a
Opening (X, Y)
110
×
110
µ
m
PAD No 30 to 109
Pad
b
Opening (X, Y)
110
×
110
µ
m
PAD No 20 to 29, 110 to 119
Pad
c
Opening (X, Y)
110
×
110
µ
m
PAD No 1 to 19
5. PAD
Á
Pad layout
Chip size: ........................... 13.43 mm
×
1.76 mm
Chip thickness: ................... 400
µ
m (Typ.)
AL pad specifications (S1D16501D00A
*
)
www.DataSheet4U.com
Содержание S1D16000 Series
Страница 5: ...Selection Guide www DataSheet4U com ...
Страница 7: ...S1D16006 Series Rev 2 1 www DataSheet4U com ...
Страница 23: ...S1D16400 www DataSheet4U com ...
Страница 38: ...S1D16501 Rev 1 0 www DataSheet4U com ...
Страница 53: ...S1D16700 Rev 1 1 www DataSheet4U com ...
Страница 68: ...S1D16702 Rev 1 0 www DataSheet4U com ...