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GSM0128IG001
17
Revision Draft – 9/22/08
4.7 General layout guidelines for Enfora GSM modules
To ensure lowest possible EMI emission, maximum thermal conduction and mechanical integrity, all metal
tabs on the GSM module shield must be soldered down on to a continuous ground plane. The PCB trace
that feeds the RF output port should be 50ohm characteristic impedance, coplanar, or routed into internal
layers to keep the top layer continuous around and underneath the device. Provide ample ground vias
around metal tabs, the RF trace and launch pad. If possible, keep I/O and power traces away from the RF
port.