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RXi2-UP IPC Hardware Reference Manual
Section 1
GFK-3047D
Oct 2021
Introduction
1
Section 1:
Introduction
1.1
Revisions to this Manual
Rev
Date
Description
D
Oct 2021
Updates to support Movicon.NExT software bundle
C
Nov 2021
UKCA Update
B
March 2021
Update to IEC/UL 62368
A
Nov 2019
Emerson Rebranding
-
May 2019
Initial Release
1.2
Related Documentation
Documents
Document Number
RXi2-UP Quick Start Guide
GFK-3221
RXi2-UP Hardware Reference Manual
GFK-3047
RXi2 IPC Secure Deployment Guide
GFK-3200
RXi2-UP Industrial PC Datasheet
00813-0100-0120
1.3
Features
The RXi2-UP IPC industrial computing platform delivers compact, rugged, high-
performance computing and high-performance graphics capabilities to run Human-
machine Interface (HMI), historian, and analytics applications for real-time control of
operations. It offers expansion options of 1, 2, or 4 (mini and low profile) PCI Express (PCIe)
slots and CFast storage.
A Computer-On-Module (COM) is a module containing all components necessary for a
bootable host computer, packaged as a super component. A COM requires a carrier board
to connect I/O and power up. COMs are used to build modular solutions and offer Original
Equipment Manufacturers (OEMs) fast time-to-market with reduced development costs.
Like integrated circuits, they provide OEMs with significant freedom in meeting form-fit-
function requirements. For these reasons, the COM methodology has gained much
popularity with OEMs in the embedded industry.
The RXi2-UP IPC is composed of the following components:
•
bCOM6L20 COM Express module based on Intel® Kaby Lake 7th Generation
Core™ i5/
i7 and Xeon® V6 series