RXi2-UP IPC Hardware Reference Manual
Section 2
GFK-3047D
Oct 2021
Capability and Compatibility
4
Section 2:
Capability and Compatibility
The bCOM6L20 COM Express module is a fully IBM-AT compatible single board computer
module containing many functions in a very small form factor. It is based on the PICMG COM
Express Module Base Specification V2.1 Type 6. (Refer to the documentation located at
) The bCOM6L20 uses the Intel x86 7th Generation Core Processor and
Intel Xeon v6 Processors to provide most of the interface.
The CEC09 COM Express carrier board is also compliant with the PICMG COM Express
Module Base Specification V2.1 Type 6.
The PERC10 and PERC11 PCI Express (PCIe) riser boards provide signals from the Edge
connector interface to a PCIe packet switch device (limited to PCIe Gen2) through PCIe
expansion slots. The PERC12 riser board provides signals from the Edge and is a passive
device that supports a PCIe Gen3 link.
The PIP24VDC power supply module provides a voltage input of nominal 24 V (± 25%).
2.1
Software Requirements
•
Microsoft® Windows® 10 Professional 64-Bit
•
Linux® Kernel 4.8
2.2
Features
RXi2-UP IPC module features are as follows:
•
7th Generation Intel Core Processor and Intel Xeon Processor E3-1200 v6 product
line
▪
i5-7442EQ 25W 4c/4t HD530 2.1GHz (max 2.9) GHz 6MB, 16GB no ECC
with QM175
▪
i7-7820EQ 45/35W 4c/8t HD530 3.0 GHz (max 3.7) GHz 8MB, 16GB no
ECC with QM175
▪
E3-1501L v6 25W 4c/4t HDP530 2.1 GHz (max 2.9) GHz 6MB, 32GB ECC
with CM238
▪
E3-1501M v6 45W 4c/4t HDP530 2.9 GHz (max 3.6) GHz 6MB, 32GB ECC
with CM238
▪
E3-1505L v6 25W 4c/8t HDP530 2.2 GHz (max 3.0) GHz 8MB, 32GB ECC
with CM238
▪
E3-1505M v6 45/35W 4c/8t HDP530 3.0 GHz (max 4.0) GHz 8MB,32GB
ECC with CM238
•
System memory:
▪
8 GB up to 32 GB DDR3 SDRAM (soldered) with ECC running at
2133/2400 MHz
▪
Organized dual channel with two ranks each
•
2x Display Port
•
4x USB 3.0
