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APPLYING THERMAL COMPOUND
Wipe off the remains of the original thermal compound using a
nonabrasive cloth or Q-tip, as shown in the sample image.
Apply the enclosed EK-TIM Ectotherm thermal grease (thermal
compound) on the CPU heat spreader – IHS – as shown in the
image. The layer of the thermal compound must be thin and even in
thickness over the entire surface of the IHS.
The excessive or uneven application of thermal grease may
lead to poor performance!
EK-TIM Echotherm (information)
Type
Low viscosity
Electrical conductivity
No
Optimal working temperature
+100 to -50 °C
Thermal conductivity
8,5 W/mK
Density
3 g/cm³
STEP 3
Install the four (4) supplied LGA-115x specific thumb screws into
four (4) M4 threaded holes of the already-installed backplate. It’s
mandatory to place an M4 PVC washer underneath each M4 thumb
screw. Tighten the screws to the backplate until you reach the end of
the thread. Using tools (e.g., pliers) is not recommended.
Do not overtighten the screws.
LGA-115x
Screw
STEP 3
M4 PVC
Washer
Non-abrasive
cloth
IHS