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38
10.Production Guidance
10.1 Reflow Soldering Temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
(
Tsmin
)
Min preheating temp. 100℃
150℃
Preheat temperature max (Tsmax)
Mx preheating temp.
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate 3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temp.
183℃
217℃
Time
(
tL
)
Maintained Above
(
TL
)
Time below liquid
phase line
60-90 sec
30-90 sec
Peak temperature
(
Tp
)
Peak temp.
220-235℃
230-250℃
Aveage ramp-down rate
(
Tp to Tsmax
)
Average ramp-down
rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time to peak
temperature for 25℃
6 minutes max
8 minutes max
Chart 10- 1 Reflow soldering temperature
Содержание E104-BT5011A
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