Chengdu Ebyte Electronic Technology Co., Ltd
E104-BT10-IPX User Manual
Copyright ©2012–2019
，
C
hengdu Ebyte Electronic Technology Co., Ltd
7-28
7
、
Production Guidance
7.1 Reflow Soldering Curve
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
100
℃
150
℃
Preheat temperature max (Tsmax)
150
℃
200
℃
Preheat Time (Tsmin to Tsmax)(ts)
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
3
℃
/second max
3
℃
/second max
Liquidous Temperature (TL)
183
℃
217
℃
Time
（
tL
）
Maintained Above
（
TL
）
60-90 sec
30-90 sec
Peak temperature
（
Tp
）
220-235
℃
230-250
℃
Aveage ramp-down rate
（
Tp to Tsmax
）
6
℃
/second max
6
℃
/second max
Time 25
℃
to peak temperature
6 minutes max
8
minutes max
7.2 Reflow Soldering Curve
