Ebyte E103-W05A, Руководство пользователя

Страница: 9 / 33

Chengdu Ebyte Electronic Technology Co., Ltd. E03-W05A User Manual
Copyright ©2012–2020
，
Chengdu Ebyte Electronic Technology Co., Ltd 8
module. If it is necessary to pass under the module, assuming that the module is soldered to the Top Layer, lay
copper on the top layer of the contact part of the module (all copper And well grounded), it must be close to the
digital part of the module and routed in the Bottom Layer
；

Assuming that the module is soldered or placed on the Top Layer, it is also wrong to randomly route the wires on
the Bottom Layer or other layers, which will affect the stray and receiving sensitivity of the module to varying
degrees
；

Assuming that there are devices with large electromagnetic interference around the module, it will greatly affect the
performance of the module. According to the intensity of the interference, it is recommended to stay away from the
module. If the situation permits, proper isolation and shielding can be done.
；

Assuming that there are traces with large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power wiring), it will also greatly affect the performance of the module. According to the
intensity of the interference, it is recommended to stay away from the module. Isolation and shielding
；
4.2 Software writing

The module chip solution is Winner Micro W600, and its driving method is completely equivalent to W600, and
users can operate according to the W600 chip book;

The GPIO15 and GPIO16 of the internal chip (external 2 and 3 pins) are general-purpose I/O ports, and the related
AT commands can be used for pins;