18
六、
Operation:
This machine could apply to in soldering and desoldering the BGA chip
1. Preheating:
Preheating before reworking, the temperature of constant temperature oven is set at 80
℃
-100
℃
,
for 4-8 hours to demoist the PCBA ,to prevent the explose during reworking
2. Desoldering
1
）
.Swith the power on , the touch screen will enter the main working interface (picture 5)click
to select the proper profile (If the profile are not suitable, you can set the profile as
mentioned above )
2).Keep the center of upper and bottom heaters in a vertical line when positioning, then fix the PCB clip
Keep the bottom of the nozzle of upper heater 2-3mm above BGA chip Click
to run the
, then it will work as you settled After the process finished, raise up the Upper heater,
then take the BGA chip off with vacuum pen The procedure of desoldering is finished
图
12
3.Clean-up the pad
You can clean-up the BGA pad with wick line; the best way to dismounting the tin right after the BGA
removed and the temperature difference make less damage to the pad; It can improve the activity of
soldering tin with the flux and is better to clean the soldering tin Pay attention that do not to damage the
PCB pad, and in order to ensure the reliability of BGA solder, try to use some volatile solvents when
cleaning the pad, such as plate washer water, industrial alcohol
4.BGA re-balling
Apply the paste flux evenly with the brush pen on the BGA pad, fix it on the BGA reball fixture, choose the
right stencil, and then plant tin balls properly
5.Soldering BGA balls
After setting the BGA reball station properly, put the reballed BGA chip on it, remove it after the ball is
soldered
6
.
Apply paste flux
Apply the paste flux with the brush pen on the PCB pad If you apply so much, it will cause connected
welding, on the contrary, it will cause null welding In order to wipe off dust and impurity of tin balls, and
enhance welding effect, the welding paste must be wiped equally
7
、
Place the BGA chip
Place the BGA chip on the PCB board with manual alignment and silk-screen borders,
meanwhile the tension of the solder joint when melt will have a good self- alignment effect.
Содержание DH-G200
Страница 5: ...5 Functions...
Страница 9: ...9 3 Click the input box it will appear as follow...
