AMBE-20X0™-HDK Development Board
User’s Manual
(Preliminary)
Section – Table of Contents
B
OARD
C
ONNECTIONS
........................................................................................ 28
A
UDIO
I/O
C
ONNECTIONS
.................................................................................... 28
H
EADER
C
ONNECTIONS
....................................................................................... 30
E
LECTRICAL
I
NPUT
.............................................................................................. 30
M
ECHANICAL
...................................................................................................... 30
JTAG
C
ONNECTIONS
S
ETUP
&
C
ONTROL
............................................................ 30
Section 6 A
DDITIONAL
R
ESOURCES
................................................... 31
T
HIRD
P
ARTY
T
OOLS
........................................................................................... 31
P
RINTED
C
IRCUIT
B
OARD
L
AYOUT
D
IAGRAM
........................................................ 31
S
CHEMATICS
....................................................................................................... 31
Analog I/O ................................................................................................. 32
MSP .......................................................................................................... 33
Serial......................................................................................................... 34
Xilinx ......................................................................................................... 35
Codec ....................................................................................................... 37
Configuration............................................................................................. 38
Power........................................................................................................ 39
AMBE-2000™ Vocoder Chip .................................................................... 40
MSP430
I
NPUT
/O
UTPUT
P
IN
D
ESCRIPTION
.......................................................... 41
XILINX
PLD
I
NPUT
/O
UTPUT
P
IN
D
ESCRIPTION
.................................................... 41
S
OFTWARE
D
EVELOPMENT
.................................................................................. 42
R
EFERENCE
D
ESIGNS
......................................................................................... 42
Application Information ............................................................................. 43
Additional Reference Material................................................................... 43
Section 7 S
UPPORT
.......................................................................... 44
DVSI
C
ONTACT
I
NFORMATION
............................................................................. 44
List of Tables
T
ABLE
1
AMBE-20
X
0
HDK™
F
EATURES
............................................................................... 1
T
ABLE
2
AMBE-2000™
A
PPLICATIONS
................................................................................. 4
T
ABLE
3
T
OP
P
ANEL
C
ONNECTORS
........................................................................................ 6
T
ABLE
4
H
ANDSET
P
IN
O
UT
.................................................................................................... 8
T
ABLE
5
C
ONSOLE
O
UT
UART
S
ERIAL
P
ORT
S
ETTINGS
....................................................... 10
T
ABLE
6
MSP430
JTAG
H
EADER
(JP8) .............................................................................. 10
T
ABLE
7
PLD
JTAG
P
IN OUT
............................................................................................... 11
T
ABLE
8
AMBE-2000
T
EST
P
OINTS
..................................................................................... 12
T
ABLE
9
A
NALOG
T
EST
P
OINTS
(JP2) .................................................................................. 12
T
ABLE
10
A
NALOG
T
EST
P
OINT
(JP3) .................................................................................. 12
T
ABLE
11
A
NALOG
T
EST
P
OINT
(JP4) .................................................................................. 12
T
ABLE
12
B
OARD
S
TATUS
LED'
S
......................................................................................... 13
T
ABLE
13
D
IP
S
WITCHES
1
AND
2
S
ETTINGS
........................................................................ 15
T
ABLE
14
S
TANDARD
R
ATE
T
ABLE FOR
AMBE-20
X
0............................................................ 16
T
ABLE
15
C
HANNEL
I
NTERFACE
S
ELECTION
T
ABLE
............................................................... 16
T
ABLE
16
U
NFRAMED
B
IT PER
W
ORD
S
ELECTION
T
ABLE
...................................................... 17
T
ABLE
17
J
UMPER
S
ETTINGS
............................................................................................... 17
T
ABLE
18
“HDK
F
ORMAT
”
P
ACKET
S
TRUCTURE
.................................................................. 19
T
ABLE
19
E
XAMPLE
P
ACKET
S
IZE FOR
V
ARIOUS
C
OMPRESSSED
V
OICE
D
ATA
R
ATES
............ 20
T
ABLE
20
D
IP
S
WITCH
S
ETTINGS FOR
F
ILE
I/O..................................................................... 26
T
ABLE
21
F
ILE
I/O
C
OMMAND
L
INE
O
PTIONS
........................................................................ 26
List of Figures
F
IGURE
1
BASIC BLOCK DIAGRAM OF THE
AMBE-2000
HDK
BOARD
........................................ 3
F
IGURE
2
AMBE-20
X
0™-HDK
D
EVELOPMENT
B
OARD
T
OP
................................................... 6
Содержание AMBE-20X0 HDK
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