![Digital Equipment Alpha 21164PC Скачать руководство пользователя страница 284](http://html.mh-extra.com/html/digital-equipment/alpha-21164pc/alpha-21164pc_hardware-reference-manual_2498508284.webp)
10–4
Thermal Management
29 September 1997 – Subject To Change
Thermal Design Considerations
10.3 Thermal Design Considerations
Follow these guidelines for printed circuit board (PCB) component placement:
•
Orient the 21164PC on the PCB with the heat-sink fins aligned with the airflow
direction.
•
Avoid preheating ambient air. Place the 21164PC on the PCB so that inlet air is
not preheated by any other PCB components.
•
Do not place other high-power devices in the vicinity of the 21164PC.
•
Do not restrict the airflow across the 21164PC heat sink. Placement of other
devices must allow for maximum system airflow in order to maximize the per-
formance of the heat sink.