Hardware
Mounting considerations
XBee Wi-Fi RF Module User Guide
32
Number
Description
1
Use multiple vias to help eliminate ground variations
2
Put a solid ground plane under RF trace to achieve the desired impedance
Implementing these design suggestions helps ensure that the RF pad module performs to
specifications.
Mounting considerations
We design the through-hole module to mount into a receptacle so that you do not have to solder the
module when you mount it to a board. The interface boards provided in the XBee Wi-Fi Development
Kit has two ten-pin receptacles for connecting the module.
Century Interconnect manufactures the receptacles used on Digi development boards. Several other
manufacturers provide comparable mounting solutions; however, Digi currently uses the following
receptacles:
n
Through-hole single-row receptacles: Samtec part number: MMS-110-01-L-SV (or equivalent)
n
Through-hole single-row receptacles: Mill-Max part number: 831-43-0101-10-001000
n
Surface-mount double-row receptacles: Century Interconnect part number: CPRMSL20-D-0-1
(or equivalent)
n
Surface-mount single-row receptacles: Samtec part number: SMM-110-02-SM-S
Note
We recommend that you print an outline of the module on the board to indicate the
correct orientation for mounting the module.