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Manufacturing information
Flux and cleaning
XBee Wi-Fi RF Module User Guide
199
The round holes in the drawing are for the through-hole version, and the semi-oval pads are for the
surface mount version. Pin 1 of the through-hole version connects with pin 2 of the surface mount.
Use the diagonal traces to connect the pins and the layout will work for both devices.
Flux and cleaning
We recommend that you use a “no clean” solder paste in assembling these devices. This eliminates
the clean step and ensures that you do not leave unwanted residual flux under the device where it is
difficult to remove. In addition:
n
Cleaning with liquids can result in liquid remaining under the device or in the gap between the
device and the host PCB. This can lead to unintended connections between pads.
n
The residual moisture and flux residue under the device are not easily seen during an
inspection process.