DFI G586OP, Руководство пользователя

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G586OPA
Installation Overview
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2-3
ESD portection by wearing an antistatic wrist strap and
attaching it to a metal part of the system chassis. If a
wrist strap is unavailable, establish and maintain
contact with the system chassis throughout any
procedures requiring ESD protection.
Hardware Installation
Memory Installation
The G586OPA system board can support 2MB to
128MB of memory using HSIM modules. HSIM is an
acronym for High Density Single In-line Memory.
A SIM module consists of several RAM chips soldered
onto a small circuit board. A SIM module connects to
the system board via a 72-pin card-edge connector.
The SIM sockets are divided into two banks on the
system board. The G586OPA system board uses
256Kx36, 512Kx36, 1Mx36, 2Mx36, 4Mx36 and
8Mx36 HSIM modules.
You will need 2 or 4 pieces of SIM modules, depending
on the amount of memory you intend to install. Your
system board can be configured with 2MB, 4MB, 6MB,
8MB, 10MB, 12MB, 16MB, 18MB, 20MB, 24MB,
32MB, 34MB, 36MB, 40MB, 48MB, 64MB, 66MB,
68MB, 72MB, 80MB, 96MB or 128MB of onboard
memory.
To install the SIM modules, first populate Bank 0 and
then Bank 1. Failure to do so will cause the system
board to work improperly.