Dell EMC PowerEdge R840, Технические характеристики

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R840 configurations Backplane 8 x 2.5 inch
SAS/SATA
24 x 2.5 inch
SAS/
SATA(Expander)
+ 2x 2.5
inch(rear)
24 x 2.5-inch
NVMe(Expander
)
24 x 2.5 inch
SAS/SATA/
NVMe(Expander
)
Intel Xeon Gold
6130 125 W 14 C35 C35 C35 C35
Intel Xeon
Platinum 8153 125 W 20 C35 C35 C35 C35
Intel Xeon Gold
6126 125 W 16 C35 C35 C35 C35
Intel Xeon Gold
5120 105 W 16 C35 C35 C35 C35
Intel Xeon Gold
5118 105 W 12 C35 C35 C35 C35
Intel Xeon Gold
5115 85 W 10 C35 C35 C35 C35
Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from particulates and
gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or
failure, you must rectify the environmental conditions. Remediation of environmental conditions is the responsibility of the customer.
Table 21. Particulate contamination specifications
Particulate contamination Specifications
Air Filtration
Data center air filtration as defined by ISO Class 8 per ISO 14644-1
with a 95% upper confidence limit.
NOTE: This condition applies to data center environments
only. Air filtration requirements do not apply to IT
equipment designed to be used outside a data center, in
environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or
MERV13 filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE: This condition applies to data center and non-data
center environments.
Corrosive dust
• Air must be free of corrosive dust.
• Residual dust present in the air must have a deliquescent point
less than 60% relative humidity.
NOTE: This condition applies to data center and non-data
center environments.
Technical specifications 31