5
1. Preparation for replacement
a. Soldering Iron
Use a pencil-type soldering iron that uses less than 30
watts.
b. Solder
Eutectic solder (Tin 63%, Lead 37%) is recommended.
c. Soldering time
Do not apply heat more than 4 seconds.
d. Preheating
Leadless capacitor must be preheated before installation.
(130°C~150°C, for about two minutes).
2. Removing the leadless component (Resistors, Capacitors)
Grasp the leadless component body with tweezers and alter-
nately apply heat to both electrodes. When the solder on both
electrodes is melted, remove leadless component with a twist-
ing motion.
LEADLESS (CHIP) COMPONENT REMOVAL INSTRUCTION
Note:
a. Leadless component must not be reused after removal.
b. Excessive mechanical stress and rubbing of the compo-
nent electrode must be avoided.
Note:
a. Do not attempt to lift the component off the board until
the component is completely disconnected from the
board by a twisting action.
b. Take care not to break the copper foil on printed board.
• The following procedures are recommended for the replacement of the leadless components used in this unit.
Chip
Tweezers
Soldering lron
Содержание DV- K584N-SJ
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Страница 100: ...99 TIMER SYSCON SCHEMATIC DIAGRAM K584N K484N K384N K284N K504N K304N...
Страница 101: ...100 POWER SUPPLY BLOCK DIAGRAM FREE VOLTAGE K584NY SJ M K584NZ SJ M K584NZ SG M...
Страница 103: ...102 2HD HEAD AMP BLOCK DIAGRAM K384N K284N K304N...
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Страница 105: ...104 VIDEO AUDIO BLOCK DIAGRAM K584N K484N K384N K284N K504N K304N...
Страница 106: ...105 PIF INPUT SELECTOR BLOCK DIAGRAM K584N K484N K384N K284N K504N K304N...
Страница 107: ...106 SYSCON SERVO BLOCK DIAGRAM K584N K484N K384N K284N K504N K304N SEG A SEG L SEG A SEG L SEG C SEG F G1 G8 G1 G8...
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