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CY7C1345G

Document Number: 38-05517 Rev. *E

Page 10 of 20

Maximum Ratings

Exceeding the maximum ratings may shorten the battery life of

the device. These user guidelines are not tested.
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with

Power Applied ............................................ –55°C to +125°C
Supply Voltage on V

DD

 Relative to GND ........–0.5V to +4.6V

Supply Voltage on V

DDQ

 Relative to GND.......–0.5V to +V

DD

DC Voltage Applied to Outputs

in tri-state.............................................–0.5V to V

DDQ

 + 0.5V

DC Input Voltage ................................... –0.5V to V

DD

 + 0.5V

Current into Outputs (LOW) ........................................ 20 mA
Static Discharge Voltage

(MIL-STD-883, Method 3015) ..................................  >2001V
Latch up Current.....................................................  >200 mA

Operating Range

Range

Ambient

Temperature

V

DD

V

DDQ

Commercial

0°C to +70°C 

3.3V

 

5%/+10%

2.5V –5%

to

 

V

DD

Industrial

–40°C to +85°C 

Electrical Characteristics

Over the Operating Range  

[7, 8]

Parameter

Description

Test Conditions

Min

Max

Unit

V

DD

Power Supply Voltage

3.135

3.6

V

V

DDQ

IO Supply Voltage

2.375

V

DD

V

V

OH

Output HIGH Voltage

for 3.3V IO, I

OH 

= –4.0 mA

2.4

V

for 2.5V IO, I

OH 

= –1.0 mA

2.0

V

V

OL

Output LOW Voltage

for 3.3V, IO, I

OL

= 8.0 mA

0.4

V

for 2.5V IO, I

OL 

= 1.0 mA

0.4

V

V

IH

Input HIGH Voltage

for 3.3V IO

2.0

V

DD

 + 0.3V

V

for 2.5V IO

1.7

V

DD

 + 0.3V

V

V

IL

Input LOW Voltage

[7]

for 3.3V IO

–0.3

0.8

V

for 2.5V IO

–0.3

0.7

V

I

X

Input Leakage Current except 

ZZ and MODE

GND 

 V

I

 

 V

DDQ

5

5

µ

A

Input Current of MODE

Input = V

SS

–30

µ

A

Input = V

DD

5

µ

A

Input Current of ZZ

Input = V

SS

–5

µ

A

Input = V

DD

30

µ

A

I

OZ

Output Leakage Current

GND 

 V

I

 

 V

DDQ

, Output Disabled

–5

5

µ

A

I

DD

V

DD

 Operating Supply Current V

DD 

= Max, I

OUT 

= 0 mA, 

f = f

MAX

= 1/t

CYC

7.5 ns cycle, 133 MHz

225

mA

10 ns cycle, 100 MHz

205

mA

I

SB1

Automatic CE Power down 

Current—TTL Inputs

Max V

DD

, Device Deselected, 

V

IN

 

 V

IH

 or V

IN

 

 V

IL

, f = f

MAX

inputs switching

7.5 ns cycle, 133 MHz

90

mA

10 ns cycle, 100 MHz

80

mA

I

SB2

Automatic CE Power down 

Current—CMOS Inputs 

Max V

DD

, Device Deselected, 

V

IN

 

 V

DD

 – 0.3V or V

IN

 

 0.3V, 

f = 0, inputs static

All speeds

40

mA

I

SB3

Automatic CE Power down 

Current—CMOS Inputs 

Max V

DD

, Device Deselected, 

V

IN

 

 V

DDQ 

– 0.3V or V

IN

 

 

0.3V, f = f

MAX

, inputs switching

7.5 ns cycle, 133 MHz

75

mA

10 ns cycle, 100 MHz

65

mA

I

SB4

Automatic CE Power down 

Current—TTL Inputs 

Max V

DD

, Device Deselected, 

V

IN

 

 V

DD 

– 0.3V or V

IN

 

 0.3V, 

f = 0, inputs static

All speeds

45

mA

Notes

7. Overshoot: V

IH

(AC) < V

DD

 +1.5V (Pulse width less than t

CYC

/2), undershoot: V

IL

(AC) > –2V (Pulse width less than t

CYC

/2).

8. T

Power up

: Assumes a linear ramp from 0V to V

DD

(min) within 200 ms. During this time V

IH

 < V

DD

 and V

DDQ 

< V

DD.

Содержание CY7C1345G

Страница 1: ...positive edge triggered Clock Input CLK The synchronous inputs include all addresses all data inputs address pipelining Chip Enable CE1 depth expansion Chip Enables CE2 and CE3 Burst Control inputs A...

Страница 2: ...ARRAY MODE A 1 0 ZZ DQs DQP A DQP B DQP C DQP D A0 A1 A ADV CLK ADSP ADSC BW D BW C BW B BW A BWE CE1 CE2 CE3 OE GW SLEEP CONTROL DQA DQPA BYTE WRITE REGISTER DQB DQP B BYTE WRITE REGISTER DQC DQP C...

Страница 3: ...VDDQ DQC DQC NC VDD NC VSS DQD DQD VDDQ VSSQ DQD DQD DQD DQD VSSQ VDDQ DQD DQD DQPD A A CE 1 CE 2 BW D BW C BW B BW A CE 3 V DD V SS CLK GW BWE OE ADSP A A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18...

Страница 4: ...Q CE2 A DQC VDDQ DQC VDDQ VDDQ VDDQ DQD DQD NC NC VDDQ VDD CLK VDD VSS VSS VSS VSS VSS VSS VSS VSS NC 576M NC 1G NC NC NC NC NC NC NC 36M NC 72M NC VDDQ VDDQ VDDQ A A A A CE3 A A A A A A A0 A1 DQA DQC...

Страница 5: ...ols the direction of the IO pins When LOW the IO pins act as outputs When deasserted HIGH IO pins are tri stated and act as input data pins OE is masked during the first clock of a read cycle when eme...

Страница 6: ...W The addresses presented are loaded into the address register and the burst inputs GW BWE and BWx are ignored during this first clock cycle If the write inputs are asserted active see Write Cycle Des...

Страница 7: ...e are not considered valid nor is the completion of the operation guaranteed The device is deselected prior to entering the sleep mode CEs ADSP and ADSC must remain inactive for the duration of tZZREC...

Страница 8: ...rite Cycle Continue Burst Next H X X L X H L L X L H D Read Cycle Suspend Burst Current X X X L H H H H L L H Q Read Cycle Suspend Burst Current X X X L H H H H H L H Tri State Read Cycle Suspend Burs...

Страница 9: ...Bytes C B DQPC DQPB H L H L L H Write Bytes C B A DQPC DQPB DQPA H L H L L L Write Byte D DQPD H L L H H H Write Bytes D A DQPD DQPA H L L H H L Write Bytes D B DQPD DQPA H L L H L H Write Bytes D B A...

Страница 10: ...0 3V V for 2 5V IO 1 7 VDD 0 3V V VIL Input LOW Voltage 7 for 3 3V IO 0 3 0 8 V for 2 5V IO 0 3 0 7 V IX Input Leakage Current except ZZ and MODE GND VI VDDQ 5 5 A Input Current of MODE Input VSS 30...

Страница 11: ...ffect these parameters Parameter Description Test Conditions 100 TQFP Package 119 BGA Package Unit JA Thermal Resistance Junction to Ambient Test conditions follow standardtestmethodsand procedures fo...

Страница 12: ...5 0 5 ns tADH ADSP ADSC Hold After CLK Rise 0 5 0 5 ns tWEH GW BWE BWx Hold After CLK Rise 0 5 0 5 ns tADVH ADV Hold After CLK Rise 0 5 0 5 ns tDH Data Input Hold After CLK Rise 0 5 0 5 ns tCEH Chip E...

Страница 13: ...CLZ tDOH tCDV tOEHZ tCDV Single READ BURST READ tOEV tOELZ tCHZ Burst wraps around to its initial state t ADVH t ADVS t WEH t WES tADH tADS Q A2 Q A2 1 Q A2 2 Q A1 Q A2 Q A2 1 Q A2 2 Q A2 3 A2 ADV sus...

Страница 14: ...2 D A2 1 D A2 1 D A1 D A3 D A3 1 D A3 2 D A2 3 A2 A3 Extended BURST WRITE D A2 2 Single WRITE tADH tADS tADH tADS t OEHZ tADVH tADVS tWEH tWES t DH t DS t WEH t WES Byte write signals are ignored for...

Страница 15: ...tAS A2 tCEH tCES Single WRITE D A3 A3 A4 BURST READ Back to Back READs High Z Q A2 Q A4 Q A4 1 Q A4 2 Q A4 3 t WEH t WES t OEHZ tDH tDS tCDV tOELZ A1 A5 A6 D A5 D A6 Q A1 Back to Back WRITEs DON T CA...

Страница 16: ...iagrams continued t ZZ I SUPPLY CLK ZZ t ZZREC ALL INPUTS except ZZ DON T CARE I DDZZ t ZZI t RZZI Outputs Q High Z DESELECT or READ Only Notes 19 Device must be deselected when entering ZZ mode See T...

Страница 17: ...19 Ball Grid Array 14 x 22 x 2 4 mm Pb Free CY7C1345G 133AXI 51 85050 100 Pin Thin Quad Flat Pack 14 x 20 x 1 4 mm Pb Free lndustrial CY7C1345G 133BGI 51 85115 119 Ball Grid Array 14 x 22 x 2 4 mm CY7...

Страница 18: ...ND FLASH SHALL NOT EXCEED 0 0098 in 0 25 mm PER SIDE 3 DIMENSIONS IN MILLIMETERS BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 0 30 0 08 0 65 20 00 0 10 22 00 0 20 1 40 0 05...

Страница 19: ...ued 1 27 20 32 2 1 6 5 4 3 7 L E A B D C H G F K J U P N M T R 12 00 19 50 30 TYP 2 40 MAX A1 CORNER 0 70 REF U T R P N M L K J H G F E D C A B 2 1 4 3 6 5 7 1 00 3X REF 7 62 22 00 0 20 14 00 0 20 1 2...

Страница 20: ...ITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE Cypress reserves the right to make changes without further notice to the materials described herein Cypress does...

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