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Document Number: 38-05517 Rev. *E

Revised July 15, 2007

Page 20 of 20

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CY7C1345G

© Cypress Semiconductor Corporation, 2004-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used
for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use
as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support
systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. 

Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
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and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress. 

Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges. 

Use may be limited by and subject to the applicable Cypress software license agreement. 

Document History Page

Document Title: CY7C1345G, 4-Mbit (128K x 36) Flow Through Sync SRAM

Document Number: 38-05517

REV.

ECN NO. Issue Date

Orig. of 

Change

Description of Change

**

224365

See ECN

RKF

New datasheet

*A

278513

See ECN

VBL

Deleted 66 MHz

Changed TQFP package to Pb-free TQFP in Ordering Information section

Added BG Pb-free package

*B

333626

See ECN

SYT

Modified Address Expansion balls in the pinouts for 100 TQFP and 119 BGA 

Packages as per JEDEC standards and updated the Pin Definitions accordingly

Modified V

OL, 

V

OH 

test conditions

Replaced ‘Snooze’ with ‘Sleep’

Removed 117 MHz speed bin

Replaced TBDs for 

Θ

JA

 and 

Θ

JC

 to their respective values on the Thermal Resis-

tance table 

Removed comment on the availability of BG Pb-free package

Updated the Ordering Information by shading and unshading MPNs as per 

availability

*C

418633

See ECN

RXU

Converted from Preliminary to Final

Changed address of Cypress Semiconductor Corporation on Page# 1 from 

“3901 North First Street” to “198 Champion Court”

Modified test condition from V

IH

 < V

DD 

to

 

V

IH 

V

DD.

Modified test condition from V

DDQ

 

< V

DD 

to V

DDQ 

< V

DD

Modified Input Load to Input Leakage Current except ZZ and MODE in the 

Electrical Characteristics Table

Replaced Package Name column with Package Diagram in the Ordering Infor-

mation table

Replaced Package Diagram of 51-85050 from *A to *B

Updated the Ordering Information

*D

480124

See ECN

VKN

Added the Maximum Rating for Supply Voltage on V

DDQ

 Relative to GND

Updated the Ordering Information table.

*E

1274724

See ECN

VKN

Corrected Write Cycle timing waveform

Содержание CY7C1345G

Страница 1: ...positive edge triggered Clock Input CLK The synchronous inputs include all addresses all data inputs address pipelining Chip Enable CE1 depth expansion Chip Enables CE2 and CE3 Burst Control inputs A...

Страница 2: ...ARRAY MODE A 1 0 ZZ DQs DQP A DQP B DQP C DQP D A0 A1 A ADV CLK ADSP ADSC BW D BW C BW B BW A BWE CE1 CE2 CE3 OE GW SLEEP CONTROL DQA DQPA BYTE WRITE REGISTER DQB DQP B BYTE WRITE REGISTER DQC DQP C...

Страница 3: ...VDDQ DQC DQC NC VDD NC VSS DQD DQD VDDQ VSSQ DQD DQD DQD DQD VSSQ VDDQ DQD DQD DQPD A A CE 1 CE 2 BW D BW C BW B BW A CE 3 V DD V SS CLK GW BWE OE ADSP A A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18...

Страница 4: ...Q CE2 A DQC VDDQ DQC VDDQ VDDQ VDDQ DQD DQD NC NC VDDQ VDD CLK VDD VSS VSS VSS VSS VSS VSS VSS VSS NC 576M NC 1G NC NC NC NC NC NC NC 36M NC 72M NC VDDQ VDDQ VDDQ A A A A CE3 A A A A A A A0 A1 DQA DQC...

Страница 5: ...ols the direction of the IO pins When LOW the IO pins act as outputs When deasserted HIGH IO pins are tri stated and act as input data pins OE is masked during the first clock of a read cycle when eme...

Страница 6: ...W The addresses presented are loaded into the address register and the burst inputs GW BWE and BWx are ignored during this first clock cycle If the write inputs are asserted active see Write Cycle Des...

Страница 7: ...e are not considered valid nor is the completion of the operation guaranteed The device is deselected prior to entering the sleep mode CEs ADSP and ADSC must remain inactive for the duration of tZZREC...

Страница 8: ...rite Cycle Continue Burst Next H X X L X H L L X L H D Read Cycle Suspend Burst Current X X X L H H H H L L H Q Read Cycle Suspend Burst Current X X X L H H H H H L H Tri State Read Cycle Suspend Burs...

Страница 9: ...Bytes C B DQPC DQPB H L H L L H Write Bytes C B A DQPC DQPB DQPA H L H L L L Write Byte D DQPD H L L H H H Write Bytes D A DQPD DQPA H L L H H L Write Bytes D B DQPD DQPA H L L H L H Write Bytes D B A...

Страница 10: ...0 3V V for 2 5V IO 1 7 VDD 0 3V V VIL Input LOW Voltage 7 for 3 3V IO 0 3 0 8 V for 2 5V IO 0 3 0 7 V IX Input Leakage Current except ZZ and MODE GND VI VDDQ 5 5 A Input Current of MODE Input VSS 30...

Страница 11: ...ffect these parameters Parameter Description Test Conditions 100 TQFP Package 119 BGA Package Unit JA Thermal Resistance Junction to Ambient Test conditions follow standardtestmethodsand procedures fo...

Страница 12: ...5 0 5 ns tADH ADSP ADSC Hold After CLK Rise 0 5 0 5 ns tWEH GW BWE BWx Hold After CLK Rise 0 5 0 5 ns tADVH ADV Hold After CLK Rise 0 5 0 5 ns tDH Data Input Hold After CLK Rise 0 5 0 5 ns tCEH Chip E...

Страница 13: ...CLZ tDOH tCDV tOEHZ tCDV Single READ BURST READ tOEV tOELZ tCHZ Burst wraps around to its initial state t ADVH t ADVS t WEH t WES tADH tADS Q A2 Q A2 1 Q A2 2 Q A1 Q A2 Q A2 1 Q A2 2 Q A2 3 A2 ADV sus...

Страница 14: ...2 D A2 1 D A2 1 D A1 D A3 D A3 1 D A3 2 D A2 3 A2 A3 Extended BURST WRITE D A2 2 Single WRITE tADH tADS tADH tADS t OEHZ tADVH tADVS tWEH tWES t DH t DS t WEH t WES Byte write signals are ignored for...

Страница 15: ...tAS A2 tCEH tCES Single WRITE D A3 A3 A4 BURST READ Back to Back READs High Z Q A2 Q A4 Q A4 1 Q A4 2 Q A4 3 t WEH t WES t OEHZ tDH tDS tCDV tOELZ A1 A5 A6 D A5 D A6 Q A1 Back to Back WRITEs DON T CA...

Страница 16: ...iagrams continued t ZZ I SUPPLY CLK ZZ t ZZREC ALL INPUTS except ZZ DON T CARE I DDZZ t ZZI t RZZI Outputs Q High Z DESELECT or READ Only Notes 19 Device must be deselected when entering ZZ mode See T...

Страница 17: ...19 Ball Grid Array 14 x 22 x 2 4 mm Pb Free CY7C1345G 133AXI 51 85050 100 Pin Thin Quad Flat Pack 14 x 20 x 1 4 mm Pb Free lndustrial CY7C1345G 133BGI 51 85115 119 Ball Grid Array 14 x 22 x 2 4 mm CY7...

Страница 18: ...ND FLASH SHALL NOT EXCEED 0 0098 in 0 25 mm PER SIDE 3 DIMENSIONS IN MILLIMETERS BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 0 30 0 08 0 65 20 00 0 10 22 00 0 20 1 40 0 05...

Страница 19: ...ued 1 27 20 32 2 1 6 5 4 3 7 L E A B D C H G F K J U P N M T R 12 00 19 50 30 TYP 2 40 MAX A1 CORNER 0 70 REF U T R P N M L K J H G F E D C A B 2 1 4 3 6 5 7 1 00 3X REF 7 62 22 00 0 20 14 00 0 20 1 2...

Страница 20: ...ITED TO THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE Cypress reserves the right to make changes without further notice to the materials described herein Cypress does...

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