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CY7C1316JV18, CY7C1916JV18
CY7C1318JV18, CY7C1320JV18

Document Number: 001-15271 Rev. *B

Page 8 of 26

Functional Overview

The CY7C1316JV18, CY7C1916JV18, CY7C1318JV18, and
CY7C1320JV18 are synchronous pipelined Burst SRAMs
equipped with a DDR interface, which operates with a read
latency of one and half cycles when DOFF pin is tied HIGH.
When DOFF pin is set LOW or connected to V

SS

 the device

behaves in DDR-I mode with a read latency of one clock cycle. 

Accesses are initiated on the rising edge of the positive input
clock (K). All synchronous input timing is referenced from the
rising edge of the input clocks (K and K) and all output timing is
referenced to the rising edge of the output clocks (C/C, or K/K
when in single clock mode).

All synchronous data inputs (D

[x:0]

) pass through input registers

controlled by the rising edge of the input clocks (K and K). All
synchronous data outputs (Q

[x:0]

) pass through output registers

controlled by the rising edge of the output clocks (C/C, or K/K
when in single-clock mode). 

All synchronous control (R/W, LD, BWS

[0:X]

) inputs pass through

input registers controlled by the rising edge of the input clock (K). 

CY7C1318JV18 is described in the following sections. The same
basic descriptions apply to CY7C1316JV18, CY7C1916JV18,
and CY7C1320JV18.

Read Operations

The CY7C1318JV18 is organized internally as two arrays of
512K x 18. Accesses are completed in a burst of two sequential
18-bit data words. Read operations are initiated by asserting
R/W

 

HIGH and LD LOW at the rising edge of the positive input

clock (K). The address presented to address inputs is stored in
the read address register and the least significant bit of the
address is presented to the burst counter. The burst counter
increments the address in a linear fashion. Following the next K
clock rise, the corresponding 18-bit word of data from this
address location is driven onto Q

[17:0]

, using C as the output

timing reference. On the subsequent rising edge of C the next
18-bit data word from the address location generated by the
burst counter is driven onto Q

[17:0]

. The requested data is valid

0.45 ns from the rising edge of the output clock (C or C, or K and
K when in single clock mode, 200 MHz and 250 MHz device). To
maintain the internal logic, each read access must be allowed to
complete. Read accesses can be initiated on every rising edge
of the positive input clock (K).

The CY7C1318JV18 first completes the pending read transac-
tions, when read access is deselected. Synchronous internal
circuitry automatically tri-states the output following the next
rising edge of the positive output clock (C). This enables a
seamless transition between devices without the insertion of wait
states in a depth expanded memory. 

Write Operations

Write operations are initiated by asserting R/W

 

LOW and LD

LOW at the rising edge of the positive input clock (K). The
address presented to address inputs is stored in the write
address register and the least significant bit of the address is
presented to the burst counter. The burst counter increments the
address in a linear fashion. On the following K clock rise the data
presented to D

[17:0]

 is latched and stored into the 18-bit write

data register, provided BWS

[1:0]

 are both asserted active. On the

subsequent rising edge of the negative input clock (K) the infor-

mation presented to D

[17:0]

 is also stored into the write data

register, provided BWS

[1:0]

 are both asserted active. The 36 bits

of data are then written into the memory array at the specified
location. Write accesses can be initiated on every rising edge of
the positive input clock (K). This pipelines the data flow such that
18 bits of data can be transferred into the device on every rising
edge of the input clocks (K and K). 

When Write access is deselected, the device ignores all inputs
after the pending write operations are completed. 

Byte Write Operations

Byte write operations are supported by the CY7C1318JV18. A
write operation is initiated as described in the 

Write Operations

section. The bytes that are written are determined by BWS

0

 and

BWS

1

, which are sampled with each set of 18-bit data words.

Asserting the byte write select input during the data portion of a
write latches the data being presented and writes it into the
device. Deasserting the Byte Write Select input during the data
portion of a write enables the data stored in the device for that
byte to remain unaltered. This feature can be used to simplify
read/modify/write operations to a byte write operation.

Single Clock Mode

The CY7C1318JV18 can be used with a single clock that
controls both the input and output registers. In this mode the
device recognizes only a single pair of input clocks (K and K) that
control both the input and output registers. This operation is
identical to the operation if the device had zero skew between
the K/K and C/C clocks. All timing parameters remain the same
in this mode. To use this mode of operation, tie C and C HIGH at
power on. This function is a strap option and not alterable during
device operation.

DDR Operation

The CY7C1318JV18 enables high-performance operation
through high clock frequencies (achieved through pipelining) and
double data rate mode of operation. The CY7C1318JV18
requires a single No Operation (NOP) cycle during transition
from a read to a write cycle. At higher frequencies, some appli-
cations may require a second NOP cycle to avoid contention.

If a read occurs after a write cycle, address and data for the write
are stored in registers. The write information must be stored
because the SRAM cannot perform the last word write to the
array without conflicting with the read. The data stays in this
register until the next write cycle occurs. On the first write cycle
after the read(s), the stored data from the earlier write is written
into the SRAM array. This is called a posted write.

If a read is performed on the same address on which a write is
performed in the previous cycle, the SRAM reads out the most
current data. The SRAM does this by bypassing the memory
array and reading the data from the registers.

Depth Expansion

Depth expansion requires replicating the LD control signal for
each bank. All other control signals can be common between
banks as appropriate.

Programmable Impedance

An external resistor, RQ, must be connected between the ZQ pin
on the SRAM and V

SS 

to enable the SRAM to adjust its output

[+] Feedback 

[+] Feedback 

Содержание CY7C1316JV18

Страница 1: ...chronous peripheral circuitry and a one bit burst counter Addresses for read and write are latched on alternate rising edges of the input K clock Write data is registered on the rising edges of both K...

Страница 2: ...ter Read Add Decode Read Data Reg R W DQ 7 0 Output Logic Reg Reg Reg 8 8 16 8 NWS 1 0 VREF Write Add Decode 8 20 C C 8 LD Control CQ CQ R W DOFF 1M x 8 Array 1M x 8 Array 8 Write Reg Write Reg CLK A...

Страница 3: ...Q 17 0 Output Logic Reg Reg Reg 18 18 36 18 BWS 1 0 VREF Write Add Decode 18 20 C C 18 LD Control Burst Logic A0 A 19 1 CQ CQ R W DOFF 512K x 18 Array 512K x 18 Array 19 18 Write Reg Write Reg CLK A 1...

Страница 4: ...S VDDQ NC NC DQ0 M NC NC NC VSS VSS VSS VSS VSS NC NC NC N NC NC NC VSS A A A VSS NC NC NC P NC NC DQ7 A A C A A NC NC NC R TDO TCK A A A C A A A TMS TDI CY7C1916JV18 2M x 9 1 2 3 4 5 6 7 8 9 10 11 A...

Страница 5: ...C A A NC NC DQ0 R TDO TCK A A A C A A A TMS TDI CY7C1320JV18 512K x 36 1 2 3 4 5 6 7 8 9 10 11 A CQ NC 144M NC 36M R W BWS2 K BWS1 LD A NC 72M CQ B NC DQ27 DQ18 A BWS3 K BWS0 A NC NC DQ8 C NC NC DQ28...

Страница 6: ...inputs are multiplexed for both read and write operations Internally the device is organized as 2M x 8 2 arrays each of 1M x 8 for CY7C1316JV18 and 2M x 9 2 arrays each of 1M x 9 for CY7C1916JV18 1M...

Страница 7: ...Input DLL Turn Off Active LOW Connecting this pin to ground turns off the DLL inside the device The timing in the DLL turned off operation is different from that listed in this data sheet For normal o...

Страница 8: ...ock rise the data presented to D 17 0 is latched and stored into the 18 bit write data register provided BWS 1 0 are both asserted active On the subsequent rising edge of the negative input clock K th...

Страница 9: ...chips use a Delay Lock Loop DLL that is designed to function between 120 MHz and the specified maximum clock frequency During power up when the DOFF is tied HIGH the DLL is locked after 1024 cycles of...

Страница 10: ...D 8 0 is written into the device D 17 9 remains unaltered H L L H During the data portion of a write sequence CY7C1316JV18 only the upper nibble D 7 4 is written into the device D 3 0 remains unaltere...

Страница 11: ...into the device D 35 9 remains unaltered L H H H L H During the Data portion of a write sequence only the lower byte D 8 0 is written into the device D 35 9 remains unaltered H L H H L H During the Da...

Страница 12: ...lling edge of TCK Instruction Register Three bit instructions can be serially loaded into the instruction register This register is loaded when it is placed between the TDI and TDO pins as shown in TA...

Страница 13: ...n register Once the data is captured it is possible to shift out the data by putting the TAP into the Shift DR state This places the boundary scan register between the TDI and TDO pins PRELOAD places...

Страница 14: ...oller follows 9 TEST LOGIC RESET TEST LOGIC IDLE SELECT DR SCAN CAPTURE DR SHIFT DR EXIT1 DR PAUSE DR EXIT2 DR UPDATE DR 1 0 1 1 0 1 0 1 0 0 0 1 1 1 0 1 0 1 0 0 0 1 0 1 1 0 1 0 0 1 1 0 SELECT IR SCAN...

Страница 15: ...H Voltage 0 65VDD VDD 0 3 V VIL Input LOW Voltage 0 3 0 35VDD V IX Input and Output Load Current GND VI VDD 5 5 A 0 0 1 2 29 30 31 Boundary Scan Register Identification Register 0 1 2 106 0 1 2 Instru...

Страница 16: ...H TDI Hold after Clock Rise 5 ns tCH Capture Hold after Clock Rise 5 ns Output Times tTDOV TCK Clock LOW to TDO Valid 10 ns tTDOX TCK Clock LOW to TDO Invalid 0 ns TAP Timing and Test Conditions Figur...

Страница 17: ...uction Codes Instruction Code Description EXTEST 000 Captures the input and output ring contents IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and TDO Th...

Страница 18: ...0 3L 7 8P 35 10E 63 1H 91 1M 8 9R 36 10D 64 1A 92 1L 9 11P 37 9E 65 2B 93 3N 10 10P 38 10C 66 3B 94 3M 11 10N 39 11D 67 1C 95 1N 12 9P 40 9C 68 1B 96 2M 13 10M 41 9D 69 3D 97 3P 14 11N 42 11B 70 3C 98...

Страница 19: ...are stable take DOFF HIGH The additional 1024 cycles of clocks are required for the DLL to lock DLL Constraints DLL uses K clock as its synchronizing input The input must have low phase jitter which i...

Страница 20: ...ote 17 VDDQ 2 0 12 VDDQ 2 0 12 V VOH LOW Output HIGH Voltage IOH 0 1 mA Nominal Impedance VDDQ 0 2 VDDQ V VOL LOW Output LOW Voltage IOL 0 1 mA Nominal Impedance VSS 0 2 V VIH Input HIGH Voltage VREF...

Страница 21: ...Junction to Ambient Test conditions follow standard test methods and procedures for measuring thermal impedance in accordance with EIA JESD51 28 51 C W JC Thermal Resistance Junction to Case 5 91 C W...

Страница 22: ...45 ns tDOH tCHQX Data Output Hold after Output C C Clock Rise Active to Active 0 45 ns tCCQO tCHCQV C C Clock Rise to Echo Clock Valid 0 45 ns tCQOH tCHCQX Echo Clock Hold after C C Clock Rise 0 45 ns...

Страница 23: ...tKL tCYC A0 D20 D21 D30 D31 Q00 Q11 Q01 Q10 A1 A2 A3 A4 Q41 tCCQO tCQOH tCCQO tCQOH tKL tCYC K K LD R W A DQ C C CQ CQ SA tKH tKHKH tCQD tCQDOH tCQH tCQHCQH Notes 24 Q00 refers to output from address...

Страница 24: ...Fine Pitch Ball Grid Array 13 x 15 x 1 4 mm Commercial CY7C1916JV18 300BZC CY7C1318JV18 300BZC CY7C1320JV18 300BZC CY7C1316JV18 300BZXC 51 85180 165 Ball Fine Pitch Ball Grid Array 13 x 15 x 1 4 mm P...

Страница 25: ...0 05 M C B A 0 15 4X 0 35 0 06 SEATING PLANE 0 53 0 05 0 25 C 0 15 C PIN 1 CORNER TOP VIEW BOTTOM VIEW 2 3 4 5 6 7 8 9 10 10 00 14 00 B C D E F G H J K L M N 11 11 10 9 8 6 7 5 4 3 2 1 P R P R K M N L...

Страница 26: ...urce Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as speci...

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