Cypress Semiconductor CY62167EV30, Техническое описание

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CY62167EV30 MoBL
®
Document #: 38-05446 Rev. *E Page 2 of 14
Pin Configuration
Figure 1. 48-Ball VFBGA (6 x 7 x 1mm) / (6 x 8 x 1mm) Top View
[1, 2, 3]
Figure 2. 48-Pin TSOP I Top View
[3, 4]
Product Portfolio
Product V
CC
Range (V)
Speed
(ns)
Power Dissipation
Range Operating I
CC
(mA)
Standby I
SB2
(
μ
A)
f = 1 MHz f = f
max
Min Typ
[5]
Max Typ
[5]
Max Typ
[5]
Max Typ
[5]
Max
CY62167EV30LL Industrial/Auto-A 2.2 3.0 3.6 45 2.2 4.0 25 30 1.5 12
WE
A
11
A
10
A
6
A
0
CE
1
I/O
10
I/O
8
I/O
9
A
4
A
5
I/O
11
I/O
13
I/O
12
I/O
14
I/O
15
V
SS
A
9
A
8
OE
Vss
A
7
I/O
0
BHE
CE
2
A
17
BLE
V
CC
I/O
2
I/O
1
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
A
15
A
14
A
13
A
12
A
19
A
18
NC
3 2 6 5 4 1
D
E
B
A
C
F
G
H
A
16
NC
V
CC
A
1
A
2
A
3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A15
A14
A13
A12
A11
A10
A9
A8
A19
NC
WE
CE
2
NC
BHE
BLE
A18
A17
A7
A6
A5
A4
A3
A2
A1
A16
BYTE
Vss
IO15/A20
IO7
IO14
IO6
IO13
IO5
IO12
IO4
Vcc
IO11
IO3
IO10
IO2
IO9
IO1
IO8
IO0
OE
Vss
CE
1
A0
Notes
1. The information related to 6 x 7 x 1 mm VFBGA package is preliminary.
2. Ball H6 for the VFBGA package can be used to upgrade to a 32M density.
3. NC pins are not connected on the die.
4. The BYTE pin in the 48-TSOPI package has to be tied to V
CC
to use the device as a 1M X 16 SRAM. The 48-TSOPI package can also be used as a 2M X 8 SRAM
by tying the BYTE signal to V
SS
. In the 2M x 8 configuration, Pin 45 is A20, while BHE, BLE and IO
8
to IO
14
pins are not used.
5. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V
CC
= V
CC
(typ), T
A
= 25°C.
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